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Failure Analysis of Solder Joints

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Assembly and Reliability of Lead-Free Solder Joints

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Abstract

As mentioned earlier that reliability of solder joints consists of three major tasks, namely DFR (design for reliability), reliability testing and data analysis, and failure analysis as shown in Fig. 6.1. The reliability testing and data analysis and DFR of lead-free solder joints have been discussed in Chaps. 6 and 7, respectively. Failure analysis is the focus of this chapter.

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Authors and Affiliations

  1. Unimicron Technology Corporation, Taoyuan, Taiwan

    John H. Lau

  2. Indium Corporation (United States), Clinton, NY, USA

    Ning-Cheng Lee

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  1. John H. Lau
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Lau, J.H., Lee, NC. (2020). Failure Analysis of Solder Joints. In: Assembly and Reliability of Lead-Free Solder Joints. Springer, Singapore. https://doi.org/10.1007/978-981-15-3920-6_8

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  • DOI: https://doi.org/10.1007/978-981-15-3920-6_8

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-3919-0

  • Online ISBN: 978-981-15-3920-6

  • eBook Packages: EngineeringEngineering (R0)

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