Abstract
This paper proposes the use of triangular cross-sectioned CNT (T-CNT) bundle interconnects for VLSI circuits. The geometry of T-CNT bundles has the advantage of offering least possible crosstalk between adjacent interconnects. The performance factors like propagation delay, power dissipated, crosstalk delay, crosstalk power, On/OFF time of the output waveforms and the output waveform swing are analyzed and compared with traditionally used square CNT (S-CNT) bundle interconnects. Results show that T-CNT bundles offer lesser power dissipation at longer lengths >1000 µm. Also the crosstalk delay is lesser for T-CNT bundles compared to S-CNT bundles. Both the types of interconnects are driven by GAA CNTFET based inverter circuits.
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Uma Sathyakam, P., Banerjee, A., Mallick, P.S. (2020). Performance Analysis of Square and Triangular CNT Bundle Interconnects Driven by CNTFET-Based Inverters. In: Sharma, D.K., Balas, V.E., Son, L.H., Sharma, R., Cengiz, K. (eds) Micro-Electronics and Telecommunication Engineering. Lecture Notes in Networks and Systems, vol 106. Springer, Singapore. https://doi.org/10.1007/978-981-15-2329-8_32
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DOI: https://doi.org/10.1007/978-981-15-2329-8_32
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