Abstract
The chip cooling has become more appealing due to the increasing integration of integrated circuits. The physical parameters of a stable phase change emulsion are obtained, and the thermosiphon loop system with a microchannel heat sink is built. The results revealed the system using a 0.5% mass concentration emulsion (cm) runs stably at a low heating power (Q ≤ 8.5 W). An increase of cm (= 1.0 and 1.5%) enables the system to present a periodic start-up characteristic at 5.0 and 7.5 W, while the system with cm = 2.0% failed to start, and the heating power of 8.5 W makes the system with cm = 2.0% achieve a steady state. Moreover, the hysteresis of peak temperature of adjacent measuring points is weakened by increasing cm or Q. Compared with the deionized water, heat transfer coefficients of the microchannel heat sink with cm = 0.5 and 2.0% were increased by 16.0% and 17.1%, respectively.
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The project is supported by National Natural Science Foundation (Number 51678102, 51508067).
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Cai, X., Wang, S., Wang, J., Zhang, T., Wu, X. (2020). An Experimental Study on the Thermosiphon Loop with a Microchannel Heat Sink Operating with the Phase Change Emulsion. In: Wang, Z., Zhu, Y., Wang, F., Wang, P., Shen, C., Liu, J. (eds) Proceedings of the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019). ISHVAC 2019. Environmental Science and Engineering(). Springer, Singapore. https://doi.org/10.1007/978-981-13-9524-6_80
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