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Effect of Boron Addition Methods on Microstructure and Mechanical Properties of a Near-α Titanium Alloy

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Physics and Engineering of Metallic Materials (CMC 2018)

Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 217))

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Abstract

This work investigated the effect of boron addition methods on microstructure and mechanical properties of a near-α titanium alloy. Ti–6.5Al–2.5Sn–9Zr–0.5Mo–1W–1Nb–0.25Si was used as the matrix, and 0.3 wt% TiB2 and 0.1 wt% B were added, respectively. The results show that the addition of trace boron forms TiB whiskers on the prior β grain boundaries and leads to significant refinement of the microstructure in the based alloy. And, the refining effect of the 0.3 wt% TiB2 and 0.1 wt% B on the base alloy is similar. At room temperature, the strength of the boron-containing alloys has a certain increase, but the elongation drops slightly. Through study on the microstructure of tensile strained specimens, it was found that the increase of tensile strength of the boron-containing alloys is the combination of the base microstructure and the whisker bearing, while the ductility drops significantly is mainly attributed to the cracking of TiB phase.

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Authors and Affiliations

  1. College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, China

    Yingying Liu, Lihua Chai, Xiaozhao Ma, Yapeng Cui, Ziyong Chen & Zhilei Xiang

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  1. Yingying Liu
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  2. Lihua Chai
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  3. Xiaozhao Ma
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  4. Yapeng Cui
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  5. Ziyong Chen
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  6. Zhilei Xiang
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Corresponding author

Correspondence to Lihua Chai .

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Editors and Affiliations

  1. Chinese Materials Research Society, Beijing, China

    Yafang Han

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Liu, Y., Chai, L., Ma, X., Cui, Y., Chen, Z., Xiang, Z. (2019). Effect of Boron Addition Methods on Microstructure and Mechanical Properties of a Near-α Titanium Alloy. In: Han, Y. (eds) Physics and Engineering of Metallic Materials. CMC 2018. Springer Proceedings in Physics, vol 217. Springer, Singapore. https://doi.org/10.1007/978-981-13-5944-6_6

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  • DOI: https://doi.org/10.1007/978-981-13-5944-6_6

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-5943-9

  • Online ISBN: 978-981-13-5944-6

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