Abstract
Based on investigations of the mechanism of precision surface formation in workpieces of anisotropic monocrystalline materials for optoelectronics, a generalized model of material removal in polishing with suspensions of polishing powders has been constructed. The removal rate in polishing sapphire planes of different crystallographic orientations has been found to grow in the series m < c < a < r with increasing volume, surface area, and most probable size of debris particles as well as with energy of dispersion of material from the face being polished. A study of the mechanism of formation of monocrystal planes of different crystallographic orientations has revealed that in polishing of sapphire the surface roughness parameters Ra, Rq, Rmax decrease in the series c > r > m > a with decreasing dielectric permittivity and thermal conductivity coefficient of the workpiece material, debris particle height, and Lifshitz constant. As a result, studies of regularities mechanical polishing optoelectronic components of crystalline materials found that polishing efficiency decreases with an increase of the binding energy and the transfer energy. It is shown that the polishing efficiency increases with increasing heat conduction coefficient of the material being processed, a processed surface road friction element by lapping and Lifshitz force. It is found that the ratio of the volume wear coefficient to the temperature conductivity coefficient of the material being processed depends on the specific heat and the transfer energy. The relative roughness of the treated surfaces of silicon carbide crystals, gallium nitride, aluminum nitride, and sapphire is characterized by the ratio: 0.68:0.67:0.63:1.00.
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Filatov, Y.D. (2019). Modeling and Experimental Study of Surfaces Optoelectronic Elements from Crystal Materials in Polishing. In: Zhang, J., Guo, B., Zhang, J. (eds) Simulation and Experiments of Material-Oriented Ultra-Precision Machining. Springer Tracts in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-3335-4_6
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DOI: https://doi.org/10.1007/978-981-13-3335-4_6
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