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Fabrication Processes for Sensors for Automotive Applications: A Review

  • Aviru Kumar BasuEmail author
  • Shreyansh Tatiya
  • Geeta Bhatt
  • Shantanu Bhattacharya
Chapter
Part of the Energy, Environment, and Sustainability book series (ENENSU)

Abstract

MEMS technology has revolutionized the industries of twenty-first century by combining the micromachining technology with the silicon microelectronics. The miniaturized devices produced from MEMS-based fabrication process have good adaptability and flexibility due to its low power consumption and compactness. MEMS devices are hugely deployed for automobiles sectors like accelerometer, gyroscopes, pressure sensors, etc. These devices are fabricated through batch fabrication in industries, using various types of fabrication technologies. In this chapter, first we have given an overview about MEMS. In the second section, we have given details about various kinds of materials which are utilized in the formation of sensors. In the third, fourth, and fifth sections, in details, different lithographic, bulk, and surface micromachining techniques, and thin film deposition techniques are discussed. At the last section, we have mentioned recent progress in MEMS-based processes, which are presently used mostly in atomic level for the fabrication of sensor and devices for automotive application.

Keywords

MEMS Sensors Actuators Microfabrication 

References

  1. Ashby MF for MEMS designers. 1–12Google Scholar
  2. Basu AK, Sah AN, Pradhan A, Bhattacharya S (2018) BSA Detection on polymeric nanocantilever, pp 1–6Google Scholar
  3. Basu AK, Sarkar H, Bhattacharya S (2016) Fabrication and resilience measurement of thin aluminium cantilevers using scanning probe microscopy. In: Proceedings of the 3rd international conference c2e2 in foundations and frontiers in computer, communication and electrical engineering, Taylor and Francis, Mankundu, pp 457–460CrossRefGoogle Scholar
  4. Curley R, Mccormack T, Phipps M (2012) Low-pressure CVD and Plasma- Enhanced CVD. 1–5Google Scholar
  5. Everhart CLM, Kaplan KE, Winterkorn MM, Kwon H, Provine J, Asheghi M, Goodson KE, Prinz FB, Kenny TW (2018) High stability thermal accelerometer based on ultrathin platinum ALD nanostructures. In: MEMS, pp 976–979Google Scholar
  6. Gong Y, Palacio D, Song X, Patel RL, Liang X, Zhao X, Goodenough JB, Huang K (2013) Stabilizing nanostructured solid oxide fuel cell cathode with atomic layer deposition. Nano Lett 13:4340–4345.  https://doi.org/10.1021/nl402138wCrossRefGoogle Scholar
  7. Hammond P (2015) Vapor phase etch processes for silicon MEMS. Elsevier Inc.Google Scholar
  8. Hirata Y (2003) LIGA process—micromachining technique using synchrotron radiation lithography—and some industrial applications. Nucl Instrum Methods Phys Res Sect B Beam Interact Mater Atoms 208:21–26.  https://doi.org/10.1016/S0168-583X(03)00632-3MathSciNetCrossRefGoogle Scholar
  9. Huard CM, Zhang Y, Sriraman S, Paterson A, Kanarik KJ, Kushner MJ (2017) Atomic layer etching of 3D structures in silicon: Self-limiting and nonideal reactions. J Vac Sci Technol A Vacuum, Surfaces, Film.  https://doi.org/10.1116/1.4979661CrossRefGoogle Scholar
  10. Benjamin J, Jency G, Vijila G (2014) A Review of Different Etching Methodologies and Impact of various etchants in Wet Etching in Micro Fabrication. Int J Innov Res Sci Eng Technol 3:558–564Google Scholar
  11. Kavitha S, Joseph Daniel R, Sumangala K (2016) Design and analysis of MEMS comb drive capacitive accelerometer for SHM and seismic applications. Meas J Int Meas Confed 93:327–339.  https://doi.org/10.1016/j.measurement.2016.07.029CrossRefGoogle Scholar
  12. Kim H, Lee HBR, Maeng WJ (2009) Applications of atomic layer deposition to nanofabrication and emerging nanodevices. Thin Solid Films 517:2563–2580CrossRefGoogle Scholar
  13. Kim KS, Kim KH, Nam Y, Jeon J, Yim S, Singh E, Lee JY, Lee SJ, Jung YS, Yeom GY, Kim DW (2017) Atomic layer etching mechanism of MoS2 for nanodevices. ACS Appl Mater Interfaces 9:11967–11976.  https://doi.org/10.1021/acsami.6b15886CrossRefGoogle Scholar
  14. Li X, Bao M, Shen S (1996) Maskless etching of three-dimensional silicon structures in KOH. Sensors Actuators, A Phys.  https://doi.org/10.1016/s0924-4247(97)80094-5CrossRefGoogle Scholar
  15. Liu X, Mwangi M, Li X, O’Brien M, Whitesides GM (2011) Paper-based piezoresistive MEMS sensors. Lab Chip 11:2189–2196.  https://doi.org/10.1039/c1lc20161aCrossRefGoogle Scholar
  16. Madou J. M (1997) Fundamentals of microfabricationGoogle Scholar
  17. Malek CK, Saile V (2004) Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review. Microelectron J 35:131–143.  https://doi.org/10.1016/j.mejo.2003.10.003CrossRefGoogle Scholar
  18. Mansoor M, Haneef I, Luca A De, Coull J, Udrea F (2018) A maskless etching technique for fabrication of 3D MEMS structures in SOI CMOS devices. J Micromech Microeng.  https://doi.org/10.1088/1361-6439/aabe0dCrossRefGoogle Scholar
  19. Metzler D, Li C, Engelmann S, Bruce RL, Joseph EA, Oehrlein GS (2016) Fluorocarbon assisted atomic layer etching of SiO 2 and Si using cyclic Ar/C 4 F 8 and Ar/CHF 3 plasma. J Vac Sci Technol A Vacuum, Surfaces, Film.  https://doi.org/10.1116/1.4935462CrossRefGoogle Scholar
  20. Millimeter-wave IT bulk micromachining for GaAs MEMSGoogle Scholar
  21. Rammohan A, Dwivedi PK, Martinez-Duarte R, Katepalli H, Madou MJ, Sharma A (2011) One-step maskless grayscale lithography for the fabrication of 3-dimensional structures in SU-8. Sensors Actuators, B Chem.  https://doi.org/10.1016/j.snb.2010.10.021CrossRefGoogle Scholar
  22. Rangelow IW (2001) Dry etching-based silicon micro-machining for MEMS. Vacuum 62:279–291.  https://doi.org/10.1016/S0042-207X00442-5CrossRefGoogle Scholar
  23. Sherpa SD, Ranjan A (2017) Quasi-atomic layer etching of silicon nitride. J Vac Sci Technol A Vacuum, Surfaces, Film 35:01A102.  https://doi.org/10.1116/1.4967236CrossRefGoogle Scholar
  24. Sobha Jayakrishnan D (2012) Electrodeposition: the versatile technique for nanomaterials. Woodhead Publishing LimitedGoogle Scholar
  25. Srinivasan T MEMS fabrication i : process flows and bulk micromachining CMOS processingGoogle Scholar
  26. Ucer KB (2010) NAN242—Thin film fabrication (Epitaxy). Wake for UniversityGoogle Scholar
  27. Xie J (2015) Fabrication challenges and test structures for high-aspect-ratio SOI MEMS devices with refilled electrical isolation trenches. Microsyst Technol 21:1719–1727.  https://doi.org/10.1007/s00542-014-2357-7CrossRefGoogle Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2019

Authors and Affiliations

  • Aviru Kumar Basu
    • 1
    • 2
    Email author
  • Shreyansh Tatiya
    • 1
    • 2
  • Geeta Bhatt
    • 1
    • 2
  • Shantanu Bhattacharya
    • 2
  1. 1.Design ProgrammeIndian Institute of Technology KanpurKanpurIndia
  2. 2.Microsystems Fabrication Laboratory, Department of Mechanical EngineeringIndian Institute of Technology KanpurKanpurIndia

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