Abstract
Thermal design of electronics subsystems containing printed circuit boards (PCBs) for space applications is quite a challenging and time-consuming job due to lack of convective environment and no possibility of repair in case of failure once subsystem is launched in the mission. Thermal designer tries to reduce modelling and computational effort by modelling multilayer PCBs in equivalent lesser number of layers. This paper deals with case study of a typical electronics subsystems having one multilayered PCB thermal modelling. Two cases are considered for thermal analysis. In one case, all layers of PCB are modelled as they are and in second case multilayered PCB (10 layers) is modelled in two equivalent layers.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Abbreviations
- \( k_{p,e} \) :
-
Effective parallel thermal conductivity
- \( k_{n,e} \) :
-
Effective normal thermal conductivity
References
Shabany, Y.: Component size and effective thermal conductivity of printed circuit boards. In: Proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2002), San Diego, pp. 489–494, 29 May–1 June 2002
Shaukatullah, H., Gaynes, M.: Experimental determination of the effect of printed circuit card conductivity on the thermal performance of surface mount electronic packages. In: Proceedings of the Tenth IEEE SEMI-THERM Symposium, pp. 44–52, Feb 1994
Lohan, J., Tiilikka, P., Rodgers, E’., Fager, C.-M., Rantala, J.: Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection. In: Proceedings of the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2000), vol. 2, pp. 213–225, May 2000
Azar, K., Gralebner, J.E.: Experimental determination of thermal conductivity of printed wiring boards. In: Proceedings of the Twelfth IEEE SEMITHERM Symposium, pp. 169–182, March 1996
Lemczyk, T.F., Mack, B., Culham, J.R., Yovanovich, M.M.: PCB trace thermal analysis and effective conductivity. In: Proceedings of the Seventh IEEE SEMI-THERM Symposium, pp. 15–22 (1991)
Culham, J.R., Yovanovich, M.M.: Factors affecting the calculation of effective conductivity in printed circuit boards. In: Proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm’98), pp. 460–467 (1998)
Berggren, A.: Design of Thermal Control System for the Spacecraft MIST. KTH Royal Institute of Technology (2015)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Mahitkar, J., Chauhan, M., Gediya, H., Singh, V.K. (2019). Printed Circuit Board Modelling for Thermal Analysis of Electronics Packages. In: Deb, D., Balas, V., Dey, R. (eds) Innovations in Infrastructure. Advances in Intelligent Systems and Computing, vol 757. Springer, Singapore. https://doi.org/10.1007/978-981-13-1966-2_25
Download citation
DOI: https://doi.org/10.1007/978-981-13-1966-2_25
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-13-1965-5
Online ISBN: 978-981-13-1966-2
eBook Packages: EngineeringEngineering (R0)