Abstract
Achieving high reliable metal–ceramic joint is dependent on both interfacial bond strength and favorable stress gradient in the interface. The work is based on comparative study of the various metal–ceramic combinations: copper with aluminum nitride and nickel with nitride to identify the best for the required operating temperature of thermoelectric module. The use of CuSil ABA alloy in paste form and a brazing alloy was prepared in-house with the same composition as that of CuSil ABA alloy was separately used for bonding metal interconnect and ceramic substrate. The microstructural analysis and study of thermal loss of the bonded substrate were studied. The comparisons of microstructures of different combinations suggest that the bonding of Cu with alumina is more effective when compared to AlN, since the interface forms a continuous TiOX reaction layer over the ceramic surface. The microstructure of post-thermal gradient tested sample is evaluated for the presence of flaws when the hot side temperature is 300 °C, which is significant suggesting the quality of the interface needs further improvement.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Change history
29 June 2019
The authors have retracted this chapter [1] because they did not have permission to use the data in the study which belongs to Anna University International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI).
References
LeBlanc, S.: Thermoelectric generators: linking material properties and systems engineering for waste heat recovery applications. Sustain. Mater. Technol. 12, 26–35 (2014)
Barako, Michael T., Park, Woosung, Morconnet, Amy M., Asheghi, Mehdi, Goodson, Kenneth E.: A reliability study with infrared imaging of thermoelectric modules under thermal cycling. IEEE Xplore (2012). https://doi.org/10.1109/ITHERM.2012.6231417,86-92
Liu, G.W., Li, W., Qiao, G.J., Wang, H.J., Yang, J.F., Lu, T.J.: J. Alloys Compd. 470, 163–167 (2009)
Rice, R.W.: Advances in Joining, vol. 69. Brook Hiu Publications, Chestnut Hill, MA (1976)
Schilm, J., Pönicke, A., Kluge, M., Sichert, I., Martin, H.-P., Michaelis, A.: TiOx based thermoelectric modules—manufacturing. Prop. Oper. Beh. Mater. Today Proc. 2, 770–779 (2015)
Akselsen, O.M.: Advances in brazing of ceramics. J. Mater. Sci. 27, 1989–2000 (1992)
Mondal, S., Pathak, L.C., Venkateswarlu, K., Das, S.K., Ray, A.K.: Development and characterization of Ag-Cu-Ti alloys for ceramic brazing. Trans. Indian Ceramic Soc. 63, 9–13 (2004)
Kozlova, O., Voytovych, R., Eustathopoulos, N.: Initial stages of wetting of alumina by reactive CuAgTi alloys. Scripta Mater. 65, 13–16 (2011)
Yadav, D.P., Kaul, R., Ganesh, P., Ram Shiroman, Sridhar, R., Kukreja, L.M.: Study on vacuum brazing of high purity alumina for application in proton synchrotron. Mater. Des. 64, 415–422 (2014)
Beeranur, R., Waghmare, K.K., Kumar Singh, R.: Characterization of vacuum brazing of SS304 and alumina ceramics with active brazing alloy. Proc. Mater. Sci. 5, 969–977 (2014)
Rongti, L., Wei, P., Jian, C., Jie, L.: Thermodynamic properties of Ti in Ag–Cu–Ti alloys. Mater. Sci. Eng., A 335, 21–25 (2002)
Wu, M., Cao, C., Xin-bo, H., Qu, X.: Brazing diamond/Cu composite to alumina using reactive Ag-Cu-Ti alloy. Trans. Nonferrous Met. Soc. China 23, 1701–1708 (2013)
Ismail, B.I., Ahmed, W.H.: Recent Pat. Electrical Eng. 2, 27–39 (2009)
Roberts, P.M.: Introduction to Brazing Technology, pp. 158–165. Taylor & Francis, CRC (2016)
Kar, A., Palit Sagar, S., Ray, A.K.: Characterization of interface of Al2O3-SS braze joint. J. Mater. Charact. 58, 555–562 (2007)
Nicholas, M.G.: Active Metal Brazing, 1st edn, pp. 73–92. Springer US (1990)
Acknowledgements
The authors are thankful to International Advanced Research Centre for Powder Metallurgy and New Materials, Chennai, DST-PURSE and Anna University, Chennai.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Stalin, S., Kalaichelvan, K., Sujitha, T. (2019). RETRACTED CHAPTER: Interfacial Science in Metal–Ceramic Joining for Thermoelectric Module. In: Vijay Sekar, K., Gupta, M., Arockiarajan, A. (eds) Advances in Manufacturing Processes. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-1724-8_31
Download citation
DOI: https://doi.org/10.1007/978-981-13-1724-8_31
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-13-1723-1
Online ISBN: 978-981-13-1724-8
eBook Packages: EngineeringEngineering (R0)