Abstract
The research on the lead-free solder materials has been a hot topic in electronic packaging industry. Among the lead-free solder materials, Sn–Ag–Cu alloys is potential substitutes for conventional Sn–37Pb solder. The alloys have advantages of good wetting property, superior interfacial properties and high creep resistance. In this article, the organization and welding performance of Sn–Ag–Cu Material were investigated. The experimental results showed that the microstructure of Sn–Cu solder contained a large number of Cu6Sn5 phase, while the main phase in Sn–Ag–Cu alloys was Ag3Sn intermetallic compound which was floc and β-Sn primary crystals, but no Cu6Sn5 phase existed.
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The study is financially supported by the National Natural Science Foundation of China (No. 61674017).
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Kong, Z., Zhou, Y. (2018). Microstructure and Welding Performance of Sn–Ag–Cu Material. In: Han, Y. (eds) Advances in Materials Processing. CMC 2017. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-0107-0_2
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DOI: https://doi.org/10.1007/978-981-13-0107-0_2
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