Microstructure and Welding Performance of Sn–Ag–Cu Material

  • Zhigang Kong
  • Yilin Zhou
Conference paper
Part of the Lecture Notes in Mechanical Engineering book series (LNME)


The research on the lead-free solder materials has been a hot topic in electronic packaging industry. Among the lead-free solder materials, Sn–Ag–Cu alloys is potential substitutes for conventional Sn–37Pb solder. The alloys have advantages of good wetting property, superior interfacial properties and high creep resistance. In this article, the organization and welding performance of Sn–Ag–Cu Material were investigated. The experimental results showed that the microstructure of Sn–Cu solder contained a large number of Cu6Sn5 phase, while the main phase in Sn–Ag–Cu alloys was Ag3Sn intermetallic compound which was floc and β-Sn primary crystals, but no Cu6Sn5 phase existed.


Lead-free solder Organization Welding performance IMC 



The study is financially supported by the National Natural Science Foundation of China (No. 61674017).


  1. 1.
    C.M. Gourlay, K. Nogita, S.D. McDonald, A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu. Scripta Mater. 54, 1557–1562 (2010)CrossRefGoogle Scholar
  2. 2.
    C.M. Gourlay, J. Read, K. Nogita, The maximum fluidity length of solidifying Sn–Cu–Ag–Ni solder alloys. J. Electron. Mater. 37, 51–60 (2012)CrossRefGoogle Scholar
  3. 3.
    H.L. Pang, B.S. Xiong, T.H. Low, Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy. Int. J. Fatigue 26, 865–872 (2004)CrossRefGoogle Scholar
  4. 4.
    J.W. Yoon, Y.H. Lee, D.G. Kim, Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate. J. Alloys. Compd. 381, 151–157 (2004)CrossRefGoogle Scholar
  5. 5.
    H.K. Sung, J.M. Kim, S. Yoo, Curr. Appl. Phys. 13, 103–107 (2013)CrossRefGoogle Scholar
  6. 6.
    E.H. Amalu, W.K. Lau, N.N. Ekere, Microelectron. Eng. 88, 1610–1617 (2011)CrossRefGoogle Scholar
  7. 7.
    H. Naoyuki, U. Tokuteru, T. Yorinobu, Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys original research article. J. Alloys Compd. 527, 226–232 (2012)CrossRefGoogle Scholar
  8. 8.
    K. Nogita, J. Read, T. Nishimura, Microstructure control in Sn-0.7mass%Cu alloys. Mater. Trans. 46, 2419–2425 (2005)CrossRefGoogle Scholar
  9. 9.
    K. Fakpan, Y. Otsuka, Y. Mutoh, Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures. J. Proc. Eng. 10, 1238–1243 (2011)CrossRefGoogle Scholar
  10. 10.
    H. Nishikawa, J.Y. Piao, T. Takemoto, Microstructure of interface between Sn–Cu solder with Ni and Cu plate. J. JPN. I. MET. 70, 427–433 (2011)CrossRefGoogle Scholar
  11. 11.
    H. Nishikawa, J.Y. Piao, T. Takemoto, Interfacial reaction between Sn-0.7Cu solder and Cu substrate. J. Electron. Mater. 35, 1127–1132 (2006)CrossRefGoogle Scholar
  12. 12.
    D. Ma, W.D. Wang, S.K. Lahiri, Scallop formation and dissolution of Cu-Sn intermetallic compound during solder reflow. Appl. Phys. 91, 3312–3317 (2012)CrossRefGoogle Scholar
  13. 13.
    F. Ochoa, X. Deng, N. Chawla, Effects of cooling rate on creep behavior of a Sn-3.5 Ag alloy. J. Electron. Mater. 33, 1592–1607 (2004)CrossRefGoogle Scholar
  14. 14.
    J.X. Wang, S.B. Xue, D.S. Fang, Trans. Nonferrous Met. Soc. China 16, 1374–1378 (2006)CrossRefGoogle Scholar
  15. 15.
    K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints. J. Alloys Compd. 352, 226–236 (2009)CrossRefGoogle Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  1. 1.Research Laboratory of Electrical Contacts and ConnectorsBeijing University of Post and TelecommunicationsBeijingChina

Personalised recommendations