Microstructure and Thermal Properties of SiC/Al Composites for Electronic Packaging

  • Tong Lu
  • Yan Wang
  • Qiang Yao
  • Qiong Wang
  • Yu Hong Zhu
Conference paper


The SiC particles reinforced aluminum matrix composites for electronic packaging was prepared by using pressureless infiltration. The microstructures and thermal properties were investigated. The results shown that the composites were free of porosity, the SiC particles were distributed uniformly and which interfaces were well controlled. The bending strength was less affected by different loading speeds, the experimental results shown that the average bending strength was more than 360 MPa. By studying the fracture surface of bending specimens, the SiC particles were brittle cleavage fracture and the matrix was ductile tough fracture. The thermal performance test results indicated that the coefficient of linear expansion increased first and then decreasing with the temperature rising, and the maximum value is 8.25 × 10−6 K−1 near 300 °C. The thermal conductivity decreased gradually, when the temperature is 25 °C, the maximum thermal conductivity was 225.7 W m−1 K−1, and the density was 2.95 g/cm3, meet the requirements of electronic packaging materials.


Electronic packaging Aluminum matrix composites Linear expansion coefficient Thermal conductivity 



This work is funded by the technology project of Jiangsu Product Quality Testing & Inspection Institute through grant No. YKY2016004.


  1. 1.
    X. B. Wen, X. Z. Feng, Y. Q. Song, et al. Fabrication of SiC nanoparticulates reinforced Al matrix composites by combining pressureless infiltration with ball-milling and cold-pressing technology. Journal of Alloys and Compounds. 497(1/2 0 (2010) L1–L4.Google Scholar
  2. 2.
    K. Wang, J. F. Cheng, W. J. Sun, et al. An approach for increase of reinforcement content in particle rich zone of centrifugally cast SiCp/Al composites [J]. Journal of Composite Materials. 46(9) (2012) 1021–1027.Google Scholar
  3. 3.
    M. Schöbel, G. Fiedler, H. D. Peter, et al. The effects of different architectures on thermal fatigue in particle reinforced MMC for heat sink applications [J]. Advanced Materials Research, 59 (2009) 177–181.Google Scholar
  4. 4.
    K.K. Wang, Y. L. Kang, P. G. Song, et al. Preparation of SiCp/A356 electronic packaging materials and its thixo-forging[J]. Transactions of Nonferrous Metals Society of China, 20 (2010) 988–990.Google Scholar
  5. 5.
    X.M. Zhu, J.K. Yu, X.Y. Wang, Microstructure and properties of Al/Si/SiC composites for electronic packaging [J]. Transactions of Nonferrous Metals Society of China, 22(7) (2012) 1686–1692.Google Scholar
  6. 6.
    H. S. Lee, S. H. Hong, Pressure infiltration casting process and thermophysical properties of high volume fraction SiCp metal matrix composites [J]. Materials Science and Technology, 19(8) (2003) 1057–1064.Google Scholar
  7. 7.
    A. Fathy, A. Sadoun, M. Abdelhameed, Effect of matrix/reinforcement particle size ratio (PSR) on the mechanical properties of extruded Al–SiC composites [J]. The International Journal of Advanced Manufacturing Technology, 73(5–8) (2014) 1049–1056.Google Scholar
  8. 8.
    X. H. Qu, L. Zhang, M. Wu, et al. Review of metal matrix composites with high thermal conductivity for thermal management applications. Progress in Natural Science: Materials International, 21 (2011) 189–197.Google Scholar
  9. 9.
    F. Teng, K. Yu, J. Luo, et al. Microstructures and properties of Al–50%SiC composites for electronic packaging applications. Trans. Nonferrous Met. Soc. China 26 (2016) 2647–2652.Google Scholar
  10. 10.
    J. B. Zhu, F. C. Wang, Y. W. Wang, Interfacial structure and stability of a co-continuous SiC/Al composite prepared by vacuum-pressure infiltration. Ceramics International, 43 (2017) 6563–6570.Google Scholar
  11. 11.
    A. M. Zahedi, J. Javadpour, H. R. Rezaie, et al. The effect of processing conditions on the microstructure and impact behavior of melt infiltrated Al/SiCp composites. Ceramics International, 37 (2011) 3335–3341.Google Scholar
  12. 12.
    C.Y. Chen, C.G. Chao, Effect of particle size distribution on the properties of high volume fraction SiC-Al-Based composites [J]. Metallurgical and Materials Transactions, 31A (2000) 2351–2358.Google Scholar
  13. 13.
    Q. Zhang, Z.Y. Xiu, M. H. Song, et al. Microstructure and properties of SiCp/Al composites used for electronic packaging applications [J]. Journal of Functional Materials, 35 (2004) 1073–1076.Google Scholar

Copyright information

© Springer Nature Singapore Pte Ltd. 2018

Authors and Affiliations

  • Tong Lu
    • 1
  • Yan Wang
    • 1
  • Qiang Yao
    • 1
  • Qiong Wang
    • 1
  • Yu Hong Zhu
    • 1
  1. 1.National Supervising & Testing Center for Engineering Composite Materials’ Quality, Jiangsu Product Quality Testing & Inspection InstituteNanjingChina

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