Abstract
Three dimensionally integrated circuit (3D IC) is a promising technology in semiconductor industry. 3D IC provides several benefits over the conventional 2D IC. However, thermal issues are major concern due to high power density. So, thermal management is a challenging task for 3D IC. This paper presents a new thermal model for calculating the temperature of a 3D IC accurately. The model is simulated for 3D ICs to study the effects of various parameters like the thermal conductivities of the interface sub-layers, heat sink, power dissipation etc. on temperature of the IC. It is also observed how these parameters affect the transient thermal behavior of the IC.
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Chatterjee, S., Roy, S.K., Giri, C., Rahaman, H. (2017). Modeling and Analysis of Transient Heat for 3D IC. In: Kaushik, B., Dasgupta, S., Singh, V. (eds) VLSI Design and Test. VDAT 2017. Communications in Computer and Information Science, vol 711. Springer, Singapore. https://doi.org/10.1007/978-981-10-7470-7_36
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DOI: https://doi.org/10.1007/978-981-10-7470-7_36
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