Thermal Management of Electronics Using Sprays and Droplets
The continuous increase in power density in electronic devices coupled with miniaturization has resulted in heat fluxes going beyond 100 W/m2 where conventional cooling methods are unable to maintain the temperatures within the prescribed limits. Further, most of the electronic components have non-uniform power generation across its surface area resulting in localized hot spots of elevated temperatures. This has forced researchers and engineers to look beyond air liquid cooling and single-phase liquid cooling into newer methods that are efficient, cost-effective, and reliable.
The authors gratefully acknowledge the help of Mr. Golak Kunti, research scholar at IIT Kharagpur, for his help with editing and formatting of the write-up. Thanks are also due to all our colleagues at Intel and IIT Kharagpur for the many stimulating discussions and exchange of information on this topic that helped enrich the contents of the chapter.
- Bindiganavale G, You SM, Moon H (2014) Study of hotspot cooling using electrowetting on dielectric digital microfluidic system. In: Proceedings of IEEE international conference on micro electro mechanical systems, pp 1039–1042 (2014)Google Scholar
- Liang G, Mudawar I (2017) Review of spray cooling—Part 1: Single-phase and nucleate boiling regimes, and critical heat flux. Int J Heat Mass Transf (in press)Google Scholar
- Martinez-Galvan E, Ramos JC, Anton R, Khodabandeh R (2011) Film thickness and heat transfer measurements in a spray cooling system with R134a. J Electron Packag 133(1)Google Scholar
- Mesler R (1992) Improving nucleate boiling using secondary nucleation. In: Proceedings of engineering foundation conference, pool and external flow boiling, pp 43–47Google Scholar
- Miljkovic N, Preston DJ, Enright R, Wang EN (2013a) Electrostatic charging of jumping droplets. Nat Commun 4:2517Google Scholar
- Oh J, Birbarah P, Foulkes T, Yin SL, Rentauskas M, Neely J, Pilawa-Podgurski RCN, Miljkovic N (2017) Jumping-droplet electronics hot-spot cooling. Appl Phys Lett 110:1–6Google Scholar
- Pamula VK, Chakrabarty K (2003) Cooling of integrated circuits using droplet-based microfluidics. In: Proceedings of the 13th ACM great lakes symposium on—GLSVLSI ’03, p 84Google Scholar
- Shahriari A, Birbarah P, Oh J, Miljkovic N, Bahadur V (2016) Electric field-based control and enhancement of boiling and condensation. Nanoscale Microscale Thermophys Eng 21:1–20Google Scholar
- Watwe A, Viswanath R (2003) Thermal implications of non-uniform die power and CPU performance. In: Proceedings of InterPack ’03 conference, Paper No. IPACK 2003-35044, Maui, Hawaii, 6–11 JulyGoogle Scholar
- Webb RL (1994) Principles of enhanced heat transfer. Wiley, New YorkGoogle Scholar
- Wiedenheft KF, Guo HA, Qu X, Boreyko JB, Liu F, Zhang K, Eid F, Choudhury A, Li Z, Chen CH (2017) Hotspot cooling with jumping-drop vapor chambers. Appl Phys Lett 110Google Scholar