Abstract
The performance of Pb-free SAC305 solder joint added with porous Cu interlayer was investigated. The porous Cu interlayer was placed in a sandwich-like layer between SAC305 solder alloy and rod Cu as the substrate metal. Two different pores, 15 ppi (pore per inch, P15) and 25 ppi (P25) with the pore size approximately ϕ1.7 and ϕ1.0 mm, respectively were used. The soldering process of solder joint was carried out in three different soldering temperatures of 267, 287 and 307 °C while the holding time was set at 300 s. Tensile test was performed to evaluate the joining strength of the solder alloy with loading rate of 0.5 mm/min. The highest joint strength was recorded at 53 MPa when soldered with P25 porous Cu interlayer at 307 °C. High thermal aging test was performed in an oven, heated to temperature of 150 °C for aging time of 100, 200 and 500 h to investigate the heat and time effect on the joint strength. The results indicate the reduction of strength at the aged sample with the increased aging time. The crack initiates dominantly at the interfaces between the porous Cu/SAC305. In general, solder joint soldered with P25 of porous Cu joints have greater tensile strength (23 MPa) than P15 of porous Cu interlayer after aging test.
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Acknowledgements
The author greatly appreciated the financial support of this research by the Fundamental Research Grant Scheme (FRGS, project number FP062-2015A) from University of Malaya and contribution from Nagaoka University of Technology, Japan for their support on this study.
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Jamadon, N.H., Ahmad, N.D., Yusof, F., Ariga, T., Miyashita, Y., Shukor, M.H.A. (2017). Effect of Isothermal Aging on Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Alloy with Porous Cu Interlayer Addition. In: Awang, M. (eds) 2nd International Conference on Mechanical, Manufacturing and Process Plant Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-10-4232-4_5
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DOI: https://doi.org/10.1007/978-981-10-4232-4_5
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