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Properties of Particleboard from Kelempayan (Neolamarckia cadamba) Wood

  • Nur Sakinah Mohamed TamatEmail author
  • Nur Farahin Yusoff
  • Jamaludin Kasim
  • Wan Mohd Nazri Wan Abdul Rahman
Conference paper

Abstract

Growing demand for wood based panels has led to a shortage of wood, especially rubberwood, which has been the main raw material in the production of the Malaysian furniture and panel board industries. Kelempayan has potential to be used as alternative resources for the coming years because it is a fast growing species and can be cultivated in Malaysia as tropical country. This study was conducted to explore the potential of kelempayan for particleboard manufacture and to characterize water resistance and mechanical properties of kelempayan particleboard as affected by various resin contents and board densities. Single layer particleboard was fabricated from 2 mm particle size and bonded with phenol formaldehyde (PF) adhesive at 145 °C of hot pressing temperature. Three different levels of resin contents (7, 9, 11 %) and board densities (500, 600, 700 kg/m3) were used as variable factors. The experimental panels were tested for modulus of elasticity (MOE), modulus of rupture (MOR), internal bonding strength (IB) and water resistance according to the procedures defined by Malaysian Standard. Overall results showed that samples made from density 700 kg/m3 and 11 % resin content had the highest MOE and MOR value compare to others. Internal bonding strength also indicated the similar pattern. However, thickness swelling of the panels were very poor than requirements. We concluded that kelempayan can have potential for particleboard manufacture and promising better qualities especially for exterior purposes. Dimensional stability need to be enhanced by using various treatments or addition of chemical such as wax.

Keywords

Kelempayan Particleboard Phenol formaldehyde 

Notes

Acknowledgements

The authors would like to thank Institute of Graduate Studies of Universiti Teknologi MARA Malaysia for providing funding support. In addition, the authors thank Malayan Adhesive Company (MAC) Sdn. Bhd. Shah Alam Selangor for providing adhesive for this research. The authors also acknowledged Universiti Teknologi MARA Pahang for providing raw materials, necessary facilities and much guidance.

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Copyright information

© Springer Science+Business Media Singapore 2016

Authors and Affiliations

  • Nur Sakinah Mohamed Tamat
    • 1
    • 2
    Email author
  • Nur Farahin Yusoff
    • 1
    • 2
  • Jamaludin Kasim
    • 1
    • 2
  • Wan Mohd Nazri Wan Abdul Rahman
    • 1
    • 2
  1. 1.Faculty of Applied SciencesUniversiti Teknologi MARAShah AlamMalaysia
  2. 2.Faculty of Applied SciencesUniversiti Teknologi MARAJengkaMalaysia

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