Abstract
This paper presents a survey of the status of five active THz imaging modalities which we have developed and investigated during the last few years with the goal to explore their potential for real-time imaging. We start out by introducing a novel waveguide-based all-electronic imaging system which operates at 812 GHz. Its salient feature is a 32-pixel linear detector array heterodyne-operated at the 8th subharmonic. This array in combination with a telescope optics for object distances of 2–6 m reaches a data acquisition speed suited for real-time imaging. The second system described then is again an all-electronic scanner (now for around 300 GHz), designed for object distances of ≥8 m, which combines mechanical scanning in vertical direction, synthetic-aperture image generation in horizontal direction, and frequency-modulated continuous-wave sweeping for the depth information. The third and fourth systems follow an optoelectronic approach by relying on several- to multi-pixel parallel electro-optic detection. One imager is based on a pulsed THz-OPO and homodyne detection with a CCD camera, the other on either continuous-wave electronic or femtosecond optoelectronic THz sources and a photonic-mixing device (PMD) camera. The article concludes with a description of the state of the art of imaging with focal-plane arrays based on CMOS field-effect transistors.
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Notes
- 1.
To reach such a result, we consider a system with an input average THz power of <P> = 4 μW, corresponding to a peak power of P0 = 40 mW. Assuming a power collection efficiency of 10−4 from the scattering object, we have a THz peak power of P = 4 μW at the EO detector, which translates to an electric field amplitude of E = 6 V/m in the EO detection (assuming 100 effective pixels, each an area of (3λ)2 at 1 THz). Based on the typical sensitivity of crossed-polarizer EO detection [35] (modulation depth coefficient kEO = 2.5⋅10−6 (V/m)−1), the achievable modulation depth is 1.5⋅10−5. This is equal to the relative shot noise of a CCD/CMOS camera system (such as the CCD employed here, described below) after binning from 106 CCD pixels down to a 100 THz-image pixels with a 50 ms integration time.
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Acknowledgments
The work presented here was funded by numerous sources, including the Federal Ministry of Education and Research Germany (BMBF) through projects LYNKEUS, TERACAM, TEKZAS, and LiveDetect3D; the German Research Foundation (DFG) through PAK-73 “Dynamisches 3D Sehen mit PMD”; the European Space Agency ESA/ESTEC (contract no. 21155/07/NL/ST); WI Bank Hessen; Oerlikon AG. We are grateful for contributions by TOPTICA GmbH (Munich); Xiton GmbH (Kaiserslautern); D. Molter, J. Jonuscheit, and R. Beigang of the Fraunhofer-Institut IPM (Kaiserslautern); J. Dall, A. Kusk, V. Zhurbenko and T. Jensen of Denmark Technical University.
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Friederich, F. et al. (2014). THz Active Imaging Systems with Real-Time Capabilities. In: Corsi, C., Sizov, F. (eds) THz and Security Applications. NATO Science for Peace and Security Series B: Physics and Biophysics. Springer, Dordrecht. https://doi.org/10.1007/978-94-017-8828-1_9
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