Abstract
This paper is concerned with a recent microstructural approach to model creep crack growth. The model spans three different length scales, from the scale of individual cavities, through the grain scale up to the macroscopic scale of cracks in components and test specimens. In order to study the initial stages of creep crack growth, we consider a near-tip process window in which a large number of grains is represented discretely. This window is surrounded by a standard continuum. Macroscopic specimen dimensions and loading configuration are communicated to this near-tip region by applying boundary conditions in accordance with higher-order asymptotic stress fields for power-law creeping materials. The paper presents an overview of some recent results obtained with this type of modeling.
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Onck, P.R., Nguyen, BN., Van Der Giessen, E. (2001). Microstructural Modeling of Creep Fracture in Polycrystalline Materials. In: Murakami, S., Ohno, N. (eds) IUTAM Symposium on Creep in Structures. Solid Mechanics and its Applications, vol 86. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-9628-2_6
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DOI: https://doi.org/10.1007/978-94-015-9628-2_6
Publisher Name: Springer, Dordrecht
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