Abstract
A creep process and the associated material deterioration are temperature sensitive phenomena. A classical approach consists in accounting for the effect of temperature on the material functions in the constitutive and evolution equations of a damaged solid, cf. Ganczarski and Skrzypek Ref. [1], whereas the temperature field is considered as the steady state. In the general case, when thermo-mechanical loadings are applied to the structure, in addition to the constitutive and evolution equations with the appropriate mechanical boundary conditions, the damage coupled heat transfer equation must simultaneously be solved to yield a transient temperature field which satisfies the thermal boundary conditions. Thick plate is considered here as the 3D rotationally symmetric problem, without the additional constraints imposed when the simplified mid-thick plate theory is used Refs [2], [3].
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References
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Ganczarski, A. (2001). Thick Axisymmetric Plate Subjected to Thermo-Mechanical Damage. In: Murakami, S., Ohno, N. (eds) IUTAM Symposium on Creep in Structures. Solid Mechanics and its Applications, vol 86. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-9628-2_21
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DOI: https://doi.org/10.1007/978-94-015-9628-2_21
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