Abstract
This paper presents a state-of-the-art review of the materials and processes required for the realization of physical structures with dimensions considerably smaller than the devices and circuits that are mass-produced today for computer and electronic equipment use.
Extremely small structures (nanostmctures) with dimensions between 200 and 10 nm are very useful in exploring the effects of downscaiing silicon and III-V compound field-effect transistors (FET) and other small devices that are used to test new principles, such as ballistic and quantum effects. Electron beams are ideally suited for this exploratory work because they are easy to use and they do not require physical masks since they can be programmed to write the desired structure directly via a personal computer (PC). For this reason the paper will focus on electron beam microfabrication, although many processes are common to other forms of radiation such as UV light. X-rays or ion beams.
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© 1994 Springer Science+Business Media Dordrecht
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Hatzakis, M. (1994). Electron Beam Resists and Pattern Transfer Methods. In: Gentili, M., Giovannella, C., Selci, S. (eds) NANOLITHOGRAPHY: A Borderland between STM, EB, IB, and X-Ray Lithographies. NATO ASI Series, vol 264. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-8261-2_2
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DOI: https://doi.org/10.1007/978-94-015-8261-2_2
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