Abstract
The effect of thermal shock on mechanical strength and fracture toughness was investigated for Si3N4 with controlled flaw. 3 types of Si3N4 with different grain size, which were sintered under different conditions, were tested. Thermal shock was predicted to occur by quenching after heating those samples up to 522–722°C in air. After thermal shock was given, the strength and fracture toughness increased compared with that of as-flawed samples, the thickness of microcrack seen on the surface was reduced, and the residual stress of the area surrounding microcrack changed to compression from tension. It was assumed that the compressive residual stress, presumably acting perpendicular to the direction of crack propagation, revealed the increase of the surface energy, which in turn increased the fracture toughness and strength.
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References
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© 1993 Springer Science+Business Media Dordrecht
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Kawamura, H., Kita, H. (1993). Change of Fracture Toughness and Strength Caused by Thermal Shock for Si3N4 with Microcrack. In: Schneider, G.A., Petzow, G. (eds) Thermal Shock and Thermal Fatigue Behavior of Advanced Ceramics. NATO ASI Series, vol 241. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-8200-1_6
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DOI: https://doi.org/10.1007/978-94-015-8200-1_6
Publisher Name: Springer, Dordrecht
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