Abstract
Microelectronic technology enables miniaturized sensors compatible (or even integrated) with electronics and at reduced cost. The main production steps will be explained, problems are discussed especially those due to the high operating temperature of gas (and odour) sensors of at least 300 °C and solutions are given. A thorough analysis shows that miniaturisation may reduce heating power but that there exist technological and material restraints, like layer thickness and current density in the heater, which prevent further size reduction. The feasibility is proven by a substrate made in microelectronic technology developed for a tin oxide thin film gas sensor but may be used for other sensors too. The sensitive area (a multilayer arrangement of NiFe-heater, insulation, Au-electrodes and gas sensitive SnOx film) is placed in the centre of a thin (10 μm) membrane of silicon oxynitride supported by an outer silicon frame. The whole chip measures 2.7 by 2.7 mm2. Power consumption at the operating temperature of 300 °C amounts to only 75 mW.
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© 1992 Springer Science+Business Media Dordrecht
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Dibbern, U. (1992). Miniaturisation of Gas Sensor Substrate. Problems and Benefits of Microelectronic Technology. In: Gardner, J.W., Bartlett, P.N. (eds) Sensors and Sensory Systems for an Electronic Nose. NATO ASI Series, vol 212. Springer, Dordrecht. https://doi.org/10.1007/978-94-015-7985-8_10
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DOI: https://doi.org/10.1007/978-94-015-7985-8_10
Publisher Name: Springer, Dordrecht
Print ISBN: 978-90-481-4150-0
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