Abstract
The field of high temperature control in Electronic Assemblies is, of course, too broad to be completely covered in this text. Nevertheless, this chapter is intended to establish a basic approach to a thermal study for any unit under consideration, and to obviate the minor problems often encountered in a thermal design.
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References
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© 1990 Van Nostrand Reinhold
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Matisoff, B.S. (1990). Heat Transfer and Thermal Control. In: Handbook Of Electronics Packaging Design and Engineering. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-7047-5_6
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DOI: https://doi.org/10.1007/978-94-011-7047-5_6
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-7049-9
Online ISBN: 978-94-011-7047-5
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