Abstract
Faults on loaded printed circuit boards (PCBs) are divided into three categories: (1) component faults, caused by components failing to meet specifications; (2) manufacturing faults, due to errors encountered in PCB assembly and/or soldering; and (3) performance faults, generally resulting from weak design or dynamic device failure. Fig. 1.1 illustrates a typical production flow and indicates the sources and potential magnitude of PCB faults.
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© 1985 Van Nostrand Reinhold Company Inc.
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Bateson, J. (1985). Understanding the Production Fault Sources. In: In-Circuit Testing. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-7009-3_1
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DOI: https://doi.org/10.1007/978-94-011-7009-3_1
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-7011-6
Online ISBN: 978-94-011-7009-3
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