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Surface Mount Technology pp 471–513Cite as

Flux and Cleaning

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Abstract

The selection of flux and cleaning processes plays a critical role in the manufacturing yield and product reliability of electronic assemblies. The subjects of flux and cleaning are interrelated, one cannot be discussed without the other. The function of flux is to remove oxides and other nonmetallic impurities from the soldering surfaces and prepare a clean surface for joining. After soldering, the flux residues or contaminants must be removed by cleaning. The type of contaminant is determined primarily by the type of flux used, but halides, oxides, and various other contaminants are introduced during storage and handling, as well.

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Authors and Affiliations

  1. Systems Group, Intel Corporation, Hillsboro, Oregon, USA

    Ray P. Prasad (SMT Program Manager)

Authors
  1. Ray P. Prasad
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© 1989 Van Nostrand Reinhold

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Prasad, R.P. (1989). Flux and Cleaning. In: Surface Mount Technology. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6532-7_13

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  • DOI: https://doi.org/10.1007/978-94-011-6532-7_13

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-011-6534-1

  • Online ISBN: 978-94-011-6532-7

  • eBook Packages: Springer Book Archive

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