Abstract
Nowadays, high-power devices are integrated together with complex digital and high performance analogue circuits on the same chip. Inappropriate design and/or layout cause major problems with maximum temperature and temperature gradients between components. An accurate prediction of the electrothermal interaction is required to design this type of circuits more efficiently (Poulton et al., 1992). A new electrothermal simulation tool, called ETS, has been developed (Van Petegem et al., 1990; Van Petegem, 1993; Van Petegem et al., 1994). It allows static and transient simulations of circuits where electrical behaviour is seriously affected by thermal effects on chip.
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© 1997 Springer Science+Business Media Dordrecht
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van Petegem, W., Geeraerts, B., Sansen, W. (1997). Electrothermal Simulation of Analogue Integrated Circuits With Ets. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_8
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DOI: https://doi.org/10.1007/978-94-011-5506-9_8
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