Abstract
A numerical study is performed by a multigrid technique, to simulate the combined heat transfer conduction/laminar convection in a three-dimensional channel, with three protruding heated integrated circuits (ICs). The effects of the variation of the streamwise spacing between the ICs on the conjugate heat transfer have been studied through the evolution of the velocity, the temperature, the Nusselt number and heat flux fields.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Similar content being viewed by others
Abbreviations
- B:
-
height of the IC
- e:
-
plate thickness
- H:
-
channel height
- L:
-
channel length
- LW :
-
channel width
- LT :
-
IC width
- Ix:
-
chip length
- Iz:
-
chip width
- Tp :
-
temperature of surfaces
- T:
-
temperature (°C)
- Te :
-
inlet temperature (C°)
- Ue :
-
inlet velocity (m/s)
- LE :
-
distance between the entrance and the IC
- LS :
-
transversal distance betwen the ICs
- SL :
-
streamwise spacing betwen the ICs
- Ue :
-
inlet velocity (m/s)
- Q:
-
heat dissipation of the IC (W)
- x, y, z:
-
coordinates
- u, v, w:
-
velocity components
- λf :
-
thermal conductivity of the fluid (W/m.K)
- λPCB :
-
thermal conductivity of the PCBs (W/m.K)
- λIC :
-
thermal conductivity of the ICs (W/m.K)
- φ:
-
general variable
References
Habchi, S., and Acharya, S. (1986) Laminar mixed convection in a partially blocked, vertical channel, Int. J. Heat Mass Transfer, 29(11), 1711–1722.
Afrid, M., and Zebib, A. (1989) Natural convection air cooling of heated components mounted on a vertical wall”, Numerical Heat Transfer, Numerical Heat Transfer (A), 15, 243–259.
Afrid, M., and Zebib, A. (1989) Three-dimensional laminar and turbulent natural convection cooling of heated blocks Numerical Heat Transfer (A), 19,405–424.
Wang, H.Y. (1991) Simulation Numérique par Multigrilles des Transferts Conjugués dans les Cartes de Composants Electroniques, Thèse N° d’ordre 405, Universite de Poitiers.
Shaw, H.J., Chen, W.L., and Chen, C.K.(1991) Study on the laminar mixed convective heat transfer in three-dimensional channel with a thermal source, J. of Electronic Packaging, 113, 40–49.
Saulnier, J.B., Wang, H.Y., and Fourka, B. (1993) Differences between 2D and 3D models predictions in a channel with dissipating obstacle, Proceedings of Eurotherm Seminar 29, Thermal Management of Electronic Systems, Delft, 107–116.
Fourka, B., and Saulnier, J.B. (1995) Analysis of 3D conjugate heat transfer around two dissipating obstacles locaed in a channel, Proceedings of International Thermal Energy Congress (ITEC95), Agadir, 2, 493–498.
Patankar, S.V. (1980) Numerical Heat Transfer and Fluid Flow, McGraw-Hill Book Company.
Brandt, A. (1977) Multi-Level Adaptive Solution to Boundary-Value Problems, Mathematics of computation, 31,(138), 333–390.
Doormaal, J.P.V., and Raithby, G.D. (1984) Enhancements of the SIMPLE method for predicting incompressible fluid flow, Numerical Heat Transfer, 7, 147–163.
Vanka, S.P.(1986) Block-Implict Multigrid Solution of Navier-Stokes Equations in Primitive Variables, J. of Computational Physics, 65, 138–158
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1997 Springer Science+Business Media Dordrecht
About this paper
Cite this paper
Fourka, B., Saulnier, J.B. (1997). Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction Between Three Integrated Circuits. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_6
Download citation
DOI: https://doi.org/10.1007/978-94-011-5506-9_6
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
eBook Packages: Springer Book Archive