Abstract
In space applications, the cooling of electronic systems relies on two heat transfer mechanisms:
-
heat conduction at the component, PCB and system (casing) levels as well as contact heat transfer between the different elements of the system;
-
radiation heat transfer inside the component, between the component and its environment, from each PCB to the other ones and between the PCB’s and the enclosure.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Ledac, P., Pimont, V., Ratel, G. and Viault, A. (1993) Simulation of radiation in electronic equipment, in Thermal Management of Electronic Systems, Proceedings of the Eurotherm Seminar No. 29, Delft, 14–16 June 1993,25.1–25.7.
Petitjean, D., Lybaert, P., Filippi, E. and Sturbois, A. (1995) Measurement of practical thermal resistance values for multicavities power hybrids (MCPH) in a vacuum environment, this seminar.
Smith, R.W. and Ketelaar, D.D. (1987) Radiation matrix generation utility, ANSYS Revision 4.3 Tutorial, Doc. DN-T004, Swanson Analysis Systems Inc., Houston.
Siegel, R. and Howell, J.R. (1992) Thermal Radiation Heat Transfer, Hemisphere Publishing Corporation, Washington D.C.
Hottel, H.C. and Sarofim, A.F. (1967) Radiative Heat Transfer, Mc Graw Hill, New York.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1997 Springer Science+Business Media Dordrecht
About this paper
Cite this paper
Lybaert, P., Naveau, C., Petitjean, D., Filippi, E., Sturbois, A. (1997). Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications, Experimental Validation. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_4
Download citation
DOI: https://doi.org/10.1007/978-94-011-5506-9_4
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
Online ISBN: 978-94-011-5506-9
eBook Packages: Springer Book Archive