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Characterisation of Thermally Enhanced Plastic Packages

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Thermal Management of Electronic Systems II

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Abstract

Thermally enhanced plastic packages with integrated metal heat spreaders are an interesting type of package for telecommunication systems. This paper presents results from a thermal characterisation of 15 different thermally enhanced plastic packages, 2 standard plastic packages and 1 metal package. The characterised package types are Quad Flat Packs (PQFP) and Leaded Chip Carriers (PLCC) with pin counts from 44 to 208. The packages were obtained from five different vendors and they have been characterised according to the 3-parameter method developed and used at Ericsson.

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References

  1. Malhammar A. (1991), Thermal Models for Circuit Boards and Microcircuits Today and Tomorrow, CERT 91 Tutorial, Electronic Components Institute International Ltd, Crowborough, England.

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  2. Flodman G., A Systematic Approach to Thermal Management and Reliability Prediction in a Telecom System. Seventh Annual International Electronic Packaging Conference, Boston, Mass.

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Author information

Authors and Affiliations

  1. Ericsson Components AB, S-164 81, Kista-Stockholm, Sweden

    Are Bjorneklett & Gunnar Gustavsson

Authors
  1. Are Bjorneklett
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  2. Gunnar Gustavsson
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Editor information

Editors and Affiliations

  1. IMEC, Leuven, Belgium

    E. Beyne

  2. Philips B.V., Eindhoven, The Netherlands

    C. J. M. Lasance

  3. Catholic University Leuven, Leuven, Belgium

    J. Berghmans

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© 1997 Springer Science+Business Media Dordrecht

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Bjorneklett, A., Gustavsson, G. (1997). Characterisation of Thermally Enhanced Plastic Packages. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_15

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  • DOI: https://doi.org/10.1007/978-94-011-5506-9_15

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-6318-0

  • Online ISBN: 978-94-011-5506-9

  • eBook Packages: Springer Book Archive

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