Abstract
In this paper improvements on the thermal characterization of electronic devices by means of so-called ‘compact models’ are described. A compact model is a simple network comprising a limited number of thermal resistances (typically 7), connecting the critical part of the device (usually the junction) to the outer parts of the device and is independent of the boundary conditions applied. This method of thermal characterization is suitable for embedding in the design environments that are employed by the electronics industry, and the compact models can be incorporated in the component libraries linked to PCB thermal analysis software packages. It is demonstrated that the thermal behaviour of electronic devices such as a 208-PQFP and a CPGA can be approached within typically 6% of the full model values.
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© 1997 Springer Science+Business Media Dordrecht
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Vinke, H., Lasance, C. (1997). Thermal Characterization of Electronic Devices by Means of Improved Boundary Condition Independent Compact Models. In: Beyne, E., Lasance, C.J.M., Berghmans, J. (eds) Thermal Management of Electronic Systems II. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5506-9_11
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DOI: https://doi.org/10.1007/978-94-011-5506-9_11
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6318-0
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