Abstract
Electronics systems are continuing to strive for higher speeds and reduced size and weight. This results in increased packaging and power density, with a requirement for enhanced thermal performance and more sophisticated techniques for heat removal at the micropackage level. This, in turn, has a significant influence on the interconnection and first level assembly techniques that are used and leads to a requirement for accurate thermal design and validation tools in order to make technology and material choices at the micropackaging and assembly level. Validated thermal modelling tools are proving to be a fast and cost effective method of predicting thermal behaviour and optimising package design to enhance thermal performance. Thus, they can be quickly used to assess different package designs, heat flow strategies, and IC die attach/encapsulation materials without the need to build prototypes.
This paper details the use of thermal simulation techniques to carry out thermal performance analysis of various single chip package types including CPGA, PQFP and BGA packages. Corresponding thermal characterization of these package types is also discussed. The work will be presented in the context of two ESPRIT projects: DELPHI and CHIPPAC.
Chapter PDF
Similar content being viewed by others
Keywords
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
References
W.Temmerman, W.Nelemans, T.Goossens, E.Lauwers, C.Lacaze, “Validation of Thermal Models for electronics Components”, IEPS 1995, San Diego, September 1995
Clemens Lasance, Heinz Vinke, Harvey Rosten, Karl-Ludwig Weiner, “A Novel Approach for the Thermal Characterisation of Electronic Parts” Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, February 7–9 1995.
H.Vinke, C.Lasance, “Thermal Characterization of Electronic Devices by means of Improved Boundary Condition Independent Compact Models”, 45th. EUROTHERM Conference, Leuven, September 1995
B. Joiner, B Siegal, T Tarter, B Bright, “Use of Experimental Data in Guiding Thermal Specification Development”, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, March 5–7 1996, Austin Texas.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1998 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Slattery, O., Cahill, C., Barrett, J., O’Flaherty, M., Rodgers, K. (1998). Thermal Simulation and Characterization of Single Chip Packages. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_5
Download citation
DOI: https://doi.org/10.1007/978-94-011-5135-1_5
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6159-9
Online ISBN: 978-94-011-5135-1
eBook Packages: Springer Book Archive