Abstract
The authors investigated microwelding of Pt wires and ribbons to PdAg, PtAg and Au thick film contact pads deposited in a form of single, double or triple layer structures. The weldings were carried out using modern Hughes MCW 550 microwelder. The welding current pulse power and duration as well as welding head electrodes distance and force were varied to obtain the maximum adhesion of the lead. In order to evaluate the contacts performance mechanical strength tests and aging tests were carried out. Scanning electron microscope investigations of the connection area allowed for optimization of the contact pad thickness and lead wire diameter.
Obtained results for Pt wire of 0.08 mm in thickness welded to the double PdAg/Au thick film contact pad seem to fulfill the requirements of durable and stable electrical connection to the microstructures working at elevated temperatures.
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© 1998 Springer Science+Business Media Dordrecht
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Pisarkiewicz, T., Habdank-Wojewodzki, T., Ciez, M. (1998). Microwelding of Leads to the Film Structures Working at Elevated Temperatures. In: Harman, G., Mach, P. (eds) Microelectronic Interconnections and Assembly. NATO ASI Series, vol 54. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-5135-1_20
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DOI: https://doi.org/10.1007/978-94-011-5135-1_20
Publisher Name: Springer, Dordrecht
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