Component Assembly Using HIP Diffusion Bonding

Abstract

This paper reviews the application of process conditions developed in HIP equipment to generate sound metal-to-metal diffusion bonds. A number of examples are chosen to illustrate the capabilities of the process: modular valve assembly from stock components; valve cladding by sheet material; ultrasonic test block manufacture, and a multi-alloy part assembled from a variety of starting materials. The capabilities for solid stage diffusion bonding over large areas by HIP with a resulting narrow and controlled diffusion are evident from the examples chosen.