Abstract
The interface state density and fixed charge of plasma enhanced chemical vapour deposited SiNx / compound semiconductor interfaces are reported for several values of the insulator deposition parameters. The semiconductor substrata were bulk silicon, epitaxial InGaAs and InGaAsP. The effects of a thermal annealing in nitrogen were also shown. The experimental data can be interpreted in terms of the contributions of insulator-related structural defects and semiconductor-related defects induced by the plasma deposition process on the crystal surface.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Bagnoli P.E., Piccirillo A., Gobbi A.L., Giannetti R., (1991) ‘Electrical Characteristics of Silicon Nitride on Silicon and InGaAs as a Function of the Insulator Stoichiometry’, to be published on Applied Surface Science
Robertson J., Powell M.J. (1984), ‘Gap States in Silicon Nitride’, Appl. Phys. Lett. 44, 415–417
Piccirillo A., Gobbi A.L. (1990), ‘Physical-Electrical Properties of Silicon Nitride Deposited by PECVD on III-V Semiconductors’, J. Electrochem. Soc.12, 3910–3917
Hasegawa H., Sadawa T. (1983) ‘On the Electrical Properties of Compound Semiconductor Interfaces in Metal / Insulator / Semiconductor Structures and the Possible Origin of Interface States’, Thin Solid Films, 103, 119–140
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1992 Springer Science+Business Media Dordrecht
About this chapter
Cite this chapter
Piccirillo, A., Bagnoli, P. (1992). Electrical Characteristics of PECVD Silicon Nitride / Compound Semiconductor Interfaces for Optoelectronic Device Passivation. In: Coffa, S., Priolo, F., Rimini, E., Poate, J.M. (eds) Crucial Issues in Semiconductor Materials and Processing Technologies. NATO ASI Series, vol 222. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-2714-1_9
Download citation
DOI: https://doi.org/10.1007/978-94-011-2714-1_9
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-5203-0
Online ISBN: 978-94-011-2714-1
eBook Packages: Springer Book Archive