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Electrical Characteristics of PECVD Silicon Nitride / Compound Semiconductor Interfaces for Optoelectronic Device Passivation

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Crucial Issues in Semiconductor Materials and Processing Technologies

Part of the book series: NATO ASI Series ((NSSE,volume 222))

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Abstract

The interface state density and fixed charge of plasma enhanced chemical vapour deposited SiNx / compound semiconductor interfaces are reported for several values of the insulator deposition parameters. The semiconductor substrata were bulk silicon, epitaxial InGaAs and InGaAsP. The effects of a thermal annealing in nitrogen were also shown. The experimental data can be interpreted in terms of the contributions of insulator-related structural defects and semiconductor-related defects induced by the plasma deposition process on the crystal surface.

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References

  1. Bagnoli P.E., Piccirillo A., Gobbi A.L., Giannetti R., (1991) ‘Electrical Characteristics of Silicon Nitride on Silicon and InGaAs as a Function of the Insulator Stoichiometry’, to be published on Applied Surface Science

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  2. Robertson J., Powell M.J. (1984), ‘Gap States in Silicon Nitride’, Appl. Phys. Lett. 44, 415–417

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© 1992 Springer Science+Business Media Dordrecht

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Piccirillo, A., Bagnoli, P. (1992). Electrical Characteristics of PECVD Silicon Nitride / Compound Semiconductor Interfaces for Optoelectronic Device Passivation. In: Coffa, S., Priolo, F., Rimini, E., Poate, J.M. (eds) Crucial Issues in Semiconductor Materials and Processing Technologies. NATO ASI Series, vol 222. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-2714-1_9

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  • DOI: https://doi.org/10.1007/978-94-011-2714-1_9

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-5203-0

  • Online ISBN: 978-94-011-2714-1

  • eBook Packages: Springer Book Archive

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