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Lithography for Manufacturing at 0.25 Micrometer and Below

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Crucial Issues in Semiconductor Materials and Processing Technologies

Part of the book series: NATO ASI Series ((NSSE,volume 222))

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Abstract

The manufacture of state-of-the-art integrated circuits uses UV optical projection lithography. Whether this technology will take the industry to quarter-micrometer minimum feature sizes and below is currently a subject of intense debate. In this paper we argue that proximity x-ray lithography is better matched to the “system problem” of lithography and for this reason offers the most cost-effective path to ultra-large-scale integrated circuits with feature sizes of one tenth micrometer and below (i.e., gigascale electronics and quantum-effect electronics).

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Author information

Authors and Affiliations

  1. Center for Space Research, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts, 02139, USA

    Henry I. Smith

  2. Department of Electrical Engineering & Computer Science, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, Massachusetts, 02139, USA

    M. L. Schattenburg

Authors
  1. Henry I. Smith
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  2. M. L. Schattenburg
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Editor information

Editors and Affiliations

  1. Physics Department, University of Catania, Catania, Italy

    S. Coffa , F. Priolo  & E. Rimini ,  & 

  2. AT&T Bell Laboratories, Murray Hill, New Jersey, USA

    J. M. Poate

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© 1992 Springer Science+Business Media Dordrecht

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Smith, H.I., Schattenburg, M.L. (1992). Lithography for Manufacturing at 0.25 Micrometer and Below. In: Coffa, S., Priolo, F., Rimini, E., Poate, J.M. (eds) Crucial Issues in Semiconductor Materials and Processing Technologies. NATO ASI Series, vol 222. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-2714-1_16

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  • DOI: https://doi.org/10.1007/978-94-011-2714-1_16

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-5203-0

  • Online ISBN: 978-94-011-2714-1

  • eBook Packages: Springer Book Archive

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