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Hardness and Young’s Modulus of Cosputtered Ti-B-N and Hf-B-N Films and Correlations to their Microstructure and Composition

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Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures

Part of the book series: NATO ASI Series ((NSSE,volume 233))

Abstract

TiBN and HfBN films of varying composition have been deposited by co-sputtering from a Ti and Hf target, respectivley, and a BN target with and without applied substrate bias voltage. The chemical compostions were determined by ESCA spectroscopy, the crystal structure by glancing angle x-ray diffraction and hardness and Young’s Modulus by a nanoindenter. Highest hardness values of up to 60 GPa were obtained for films of composition TiB1.5N0.45 and HfB0.85N0.3 The grain size of these films was found to be of about 3 nm.

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Author information

Authors and Affiliations

  1. Institute for Advanced Materials, Joint Research Center of the Commission of the European Communities, C.P.1, I-21020, Ispra, VA, Italy

    T. Friesen, J. Haupt, P. N. Gibson & W. Gissler

Authors
  1. T. Friesen
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  2. J. Haupt
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  3. P. N. Gibson
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  4. W. Gissler
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Editor information

Editors and Affiliations

  1. Division of Materials Science and Technology, Los Alamos National Laboratory, Los Alamos, New Mexico, USA

    Michael Nastasi

  2. Center for Materials Science, Los Alamos National Laboratory, Los Alamos, New Mexico, USA

    Don M. Parkin

  3. Institut für Neue Materialien, Universität des Saarlandes, Saarbrücken, Germany

    Herbert Gleiter

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© 1993 Springer Science+Business Media Dordrecht

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Friesen, T., Haupt, J., Gibson, P.N., Gissler, W. (1993). Hardness and Young’s Modulus of Cosputtered Ti-B-N and Hf-B-N Films and Correlations to their Microstructure and Composition. In: Nastasi, M., Parkin, D.M., Gleiter, H. (eds) Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures. NATO ASI Series, vol 233. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1765-4_32

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  • DOI: https://doi.org/10.1007/978-94-011-1765-4_32

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-4775-3

  • Online ISBN: 978-94-011-1765-4

  • eBook Packages: Springer Book Archive

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