Abstract
The commercial introduction of bisphenol A dicyanate prepolymer in 1975 [1] targeted substrates for advanced printed circuit boards. Relatively low dielectric loss properties combined with dimensional stability at solder processing temperatures supported this marketing decision. Today, high speed, high density, multilayer circuit boards and multichip modules are the single largest use for cyanate ester resins.
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Shimp, D.A., Chin, B. (1994). Electrical properties of cyanate ester resins and their significance for applications. In: Hamerton, I. (eds) Chemistry and Technology of Cyanate Ester Resins. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1326-7_8
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DOI: https://doi.org/10.1007/978-94-011-1326-7_8
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