The thermal characteristics of a board-mounted 160 lead plastic quad flat pack.
Thermal characterisation forms an integral part of the specification of all electronic components, and standard test methods have been developed to evaluate this feature. However, the applicability of these results is being questioned because a range of values can be obtained, depending on the interpretation of the test method and variation of test conditions. The experimental approach used in the study highlights the effects of some factors such as board copper content and orientation, lead contact with the board, power level, and local air temperature on the thermal characterisation of a board mounted 160 lead Plastic Quad Flat Pack (PQFP) in a natural convection environment. This information should also prove useful to electronic system designers.
KeywordsThermal Resistance Thermal Characterisation Thermal Plume Source Side Solder Reflow
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- 1.SEMI International Standards (1992), Packaging Volume.Google Scholar
- 2.Dutta, V.B. (1988), Junction-to-Case Thermal Resistance — Still a myth ?, Proceedings of the 4th Annual IEEE SEMI-THERM Symposium, pp 8-11.Google Scholar
- 3.Shanker, B.J. and Lambertson, R.T. (1986), Sources of error in package thermal resistance measurements, Proceedings of the 36th Electronics Components Conference, pp 161-168, Seattle, WA.Google Scholar
- 4.Siegal, B.S. (1988), Factors affecting semiconductor device thermal resistance measurements, Proceedings of the 4th Annual IEEE SEMI-THERM Symposium, pp 12-18.Google Scholar
- 5.Bar-Cohen, A., Elperin, T. and Eliasi, R. (1989), ΘJc characterisation of chip packages — justification, limitations, and future, Proceedings of the 5th IEEE SEMI-THERM Symposium, pp 1-4.Google Scholar
- 6.Moffat, R.J., Ariviza, D.E., and Ortega, A. (1985), Cooling electronic components: Forced convection experiments with an air cooled array, 23rd AIChE/ASME Nat.l Heat Transfer Conference, Denver, CO.Google Scholar
- 7.Engelmaier, W., AT&T Bell Laboratories (1985), Functional cycles and surface mounting attachment reliability, Circuit World, Vol II, No. 3.Google Scholar
- 8.Crook, K., Jawaid, S., Salazar, K. and Trujillo, J. (1991), Stress screening on PMAX and PMIN modules and implementation results, Digital Equipment Corporation, TR91-0084/SSEH (Revision B).Google Scholar