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The thermal characteristics of a board-mounted 160 lead plastic quad flat pack.

  • M. Davies
  • J. Lohan
  • J. Punch
  • T. Moore

Abstract

Thermal characterisation forms an integral part of the specification of all electronic components, and standard test methods have been developed to evaluate this feature. However, the applicability of these results is being questioned because a range of values can be obtained, depending on the interpretation of the test method and variation of test conditions. The experimental approach used in the study highlights the effects of some factors such as board copper content and orientation, lead contact with the board, power level, and local air temperature on the thermal characterisation of a board mounted 160 lead Plastic Quad Flat Pack (PQFP) in a natural convection environment. This information should also prove useful to electronic system designers.

Keywords

Thermal Resistance Thermal Characterisation Thermal Plume Source Side Solder Reflow 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media Dordrecht 1994

Authors and Affiliations

  • M. Davies
    • 1
  • J. Lohan
    • 1
  • J. Punch
    • 1
  • T. Moore
    • 2
  1. 1.Department of Mechanical EngineeringUniversity of LimerickLimerickIreland
  2. 2.Analog DevicesRaheen Industrial EstateLimerickIreland

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