Thermal characterization and design for high performance multichip module type laminate

Abstract

Some of the main problems that arise during the design of high end electronic systems are related to transmission speed, interconnection density and power dissipation. Multi-chip modules offer a possible solution to reduce the density problems and they have advantages regarding electrical performance. The thermal management of MCM’s however remains a problem area due to the increased packaging density.

In this paper, alternative solutions are presented to improve the thermal performance of the MCM-L technology, based on 1) internal heat spreaders with thermal via’s for improved through-substrate conduction and 2) heat spreaders attached to the laminate with thermal wells to allow the connection of the dice directly to the heat spreader. The heat transfer to ambient is additionally improved by the use of heat sinks. The thermal performance of the MCM-L technology with attached heat spreader is further evaluated based on experimental data from measurements on different test modules and on the use of conjugate heat transfer simulations.