Abstract
An assessment is made of the limits to the cooling capability of forced convection air cooling of multi-chip modules. Therefore heat-sinks of different geometries are analysed, using a new design criterion which involves both the effects of heat transfer performance and pressure drop. It is shown that, when pressure drop is taken into account, plate fin heat-sinks have a better cooling performance than offset-strip fin or pin fin heat-sinks. The dimensions of a plate-fin heat-sink are optimized using an analytical model. The optimal plate-fin heat-sink has a cooling performance comparable to what is normally achieved by integral water cooling. To confirm the thermal performance of the optimal plate fin heat-sink, measurements are carried out in a low speed windtunnel.
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© 1994 Springer Science+Business Media Dordrecht
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Boesmans, B., Christiaens, F., Berghmans, J., Beyne, E. (1994). Design of an optimal heat-sink geometry for forced convection air cooling of Multi-Chip Modules. In: Hoogendoorn, C.J., Henkes, R.A.W.M., Lasance, C.J.M. (eds) Thermal Management of Electronic Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1082-2_24
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DOI: https://doi.org/10.1007/978-94-011-1082-2_24
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-4472-1
Online ISBN: 978-94-011-1082-2
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