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Computational modelling of wafer cooldown in a staging module

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Thermal Management of Electronic Systems

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Abstract

It is investigated how long it will take to cool down a batch of wafers from 600 to 70 °C in a so-called staging module. Different approaches are followed to estimate the time scale of the cooldown process, from simple analytical approximations to a numerical grid-based model. The numerical model describes both unsteady-state and steady-state heat transfer in an axisymmetric geometry, taking into account conduction and radiation. Water cooling and free (convective and radiative) cooling have been considered.

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Author information

Authors and Affiliations

  1. ASM Microelectronics Technology Centre, P.O. Box 100, 3720 AC, Bilthoven, The Netherlands

    K. Nederveen

Authors
  1. K. Nederveen
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Editor information

Editors and Affiliations

  1. J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands

    C. J. Hoogendoorn  & R. A. W. M. Henkes  & 

  2. Philips B.V., Eindhoven, The Netherlands

    C. J. M. Lasance

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© 1994 Springer Science+Business Media Dordrecht

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Nederveen, K. (1994). Computational modelling of wafer cooldown in a staging module. In: Hoogendoorn, C.J., Henkes, R.A.W.M., Lasance, C.J.M. (eds) Thermal Management of Electronic Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1082-2_16

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  • DOI: https://doi.org/10.1007/978-94-011-1082-2_16

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-4472-1

  • Online ISBN: 978-94-011-1082-2

  • eBook Packages: Springer Book Archive

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