Abstract
We examine the problem of the roughness represented by components mounted on vertical electronic circuit boards in airtight enclosures and which are cooled by pure natural convection. Analysis of the magnitude of the dynamic phenomena and visualization of airflow in the region of the components show that it can be characterized by natural, forced or mixed convection according to the position of the components on the circuit board and the position of the latter in the enclosure. However, temperature measurements reveal no presence of winglet, obstacle or cavity effects, be the components mounted in horizontal or vertical rows. Convective transfer is identical to that on smooth faces.
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© 1994 Springer Science+Business Media Dordrecht
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Mergui, S., Penot, F. (1994). Mixed convection and heat transfer on vertical parallel printed circuit boards. In: Hoogendoorn, C.J., Henkes, R.A.W.M., Lasance, C.J.M. (eds) Thermal Management of Electronic Systems. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1082-2_13
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DOI: https://doi.org/10.1007/978-94-011-1082-2_13
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-4472-1
Online ISBN: 978-94-011-1082-2
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