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High Pressure Thermal Bonding for Sealing of Plastic Microstructures

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Micro Total Analysis Systems 2002
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Abstract

A process for the sealing of microchannels in polycarbonate substrates via high pressure thermal bonding is investigated. Bond strength tests was performed for different bond pressures and temperatures. The crack-opening method was used to characterize the bond strength relative to other tested devices. Channel collapse of an embedded microchannel was also characterized as a function of bonding parameters.

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References

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© 2002 Springer Science+Business Media Dordrecht

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Rosenberger, F., Jones, E., Lee, C., DeVoe, D. (2002). High Pressure Thermal Bonding for Sealing of Plastic Microstructures. In: Baba, Y., Shoji, S., van den Berg, A. (eds) Micro Total Analysis Systems 2002. Springer, Dordrecht. https://doi.org/10.1007/978-94-010-0295-0_135

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  • DOI: https://doi.org/10.1007/978-94-010-0295-0_135

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-3952-9

  • Online ISBN: 978-94-010-0295-0

  • eBook Packages: Springer Book Archive

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