Abstract
To date the ion beam sputtering deposition (IBSD) technique has been used to deposit metallic, dielectric, superconductor and semiconductor films ∣1∣. Many promising results have been obtained, for example good mechanical characteristics of the films. In the demanding domain of microelectronics, a thorough knowledge, theoretical as well as experimental, of the sputtering and deposition processes seems to be necessary for determining the potential for using IBSD technique to deposit thin films ∣2∣. We have studied IBSD underlying mechanism with the aim of forming epitaxial thin films. This paper reports some results of this study.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Klabunde J. (ed): Thin films from free atoms and particles: Academic press Inc. (in press).
Schwebel C., Meyer F., Gautherin G., Pellet C. : submitted to J. Vac. Sci. Technol.
Bean J.C.: Appl. Phys. Lett. 33, 654, 1978.
Ota Y.: J. Electrochem. Soc. Vol. 126, n° 10, 1761, 1979.
Comas J., Wolicki E.A.: J. Electrochem. Soc. 117, 1197, 1970.
Pellet C., Schwebel C.: to be published.
Schwebel C., Vapaille A., Bouchier D., Gautherin G., Meyer F.: Third international congress cathodic sputtering and related applications, September 11–14, 1979
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1986 Martinus Nijhoff Publishers, Dordrecht
About this chapter
Cite this chapter
Pellet, C., Schwebel, C., Meyer, F., Gautherin, G. (1986). Growth of Thin Films by UHV ION Beam Sputtering Deposition Technique. In: Kiriakidis, G., Carter, G., Whitton, J.L. (eds) Erosion and Growth of Solids Stimulated by Atom and Ion Beams. NATO ASI Series, vol 112. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-4422-0_30
Download citation
DOI: https://doi.org/10.1007/978-94-009-4422-0_30
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-8468-0
Online ISBN: 978-94-009-4422-0
eBook Packages: Springer Book Archive