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Hot spots in Solar Cells. Test Procedures and Study of Related Phenomena

  • Conference paper
Seventh E.C. Photovoltaic Solar Energy Conference

Abstract

An indoor hot spot test procedure for photovoltaic modules is described.Test procedures for different cell interconnection circuits, from simple series connected strings to more complex series-parallel configurations, are suggested. Results from tests on nearly sixty module types are presented. Scanning electron microscopy and infrared imaging have been used to identify the basic phenomena giving rise to hot spots. Local heating has been correlated with the presence of surface defects.

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References

  1. A.M. Ricaud: “Solar Cell Failure Modes & Improvement of Reverse Characteristics”: 4th E.C PVSE Conf. 1982 p. 392.

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  2. G. Chynoweth & K.G. McKay “Photon Emission from Avalanche Breakdown in Silicon”: Phys. Rev. Vol. 102 nr. 2 p. 369, 1956.

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  3. J. Rose “Microplasmas in Silicon”: Phys. Rew. 105 nro. 2, p. 413, 1957.

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Author information

Authors and Affiliations

  1. Commission of the European Communities, Joint Research Center, Ispra Establishment, Ispra (Va), Italy

    S. Pace, J. Bishop & M. Magni

Authors
  1. S. Pace
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  2. J. Bishop
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  3. M. Magni
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Editor information

Editors and Affiliations

  1. Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

    A. Goetzberger (Conference Chairman) (Conference Chairman)

  2. Commission of the European Communities, Brussels, Germany

    W. Palz (Conference Director) & G. Willeke (Conference Director) & 

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© 1987 ECSC, EEC, EAEC, Brussels and Luxembourg

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Pace, S., Bishop, J., Magni, M. (1987). Hot spots in Solar Cells. Test Procedures and Study of Related Phenomena. In: Goetzberger, A., Palz, W., Willeke, G. (eds) Seventh E.C. Photovoltaic Solar Energy Conference. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-3817-5_56

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  • DOI: https://doi.org/10.1007/978-94-009-3817-5_56

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-8198-6

  • Online ISBN: 978-94-009-3817-5

  • eBook Packages: Springer Book Archive

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