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Reliability of High Speed HEMT Integrated Circuits and Multi-2DEG Structures

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Semiconductor Device Reliability

Part of the book series: NATO ASI Series ((NSSE,volume 175))

Abstract

The reliability of HEMT I.Cs indicates that the enhancement mode circuits are the weak point in the circuit’s reliability. Rapid degradation, has been observed at temperatures above 200°C. The HEMT I.C. reliability results tend to follow the enhancement mode degradation statistics. The primary degradation mode is the confinement of the 2DEG channel and various lateral diffusion effects, which occur during circuit operation.

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References

  1. A. Christou, Solid St. Electr. 22, 141 (1979).

    Article  Google Scholar 

  2. T.J. Drummond, W. Kop, H. Morkoc and M. Keever, App. Phys. Lett. 41, 277 (1982).

    Article  Google Scholar 

  3. M.I. Nathan and M. Heiblum, Solid State Electr. 25, 1063 (1982).

    Article  Google Scholar 

  4. J.F. Rockett and P. Delescluse, Inst. Phys. Conf. Ser., No. 65, pp. 385–392 (1982).

    Google Scholar 

  5. P.C. Chao, T. Yu, P.M. Smith, S. Wanuga and C.M. Huang, Electron. Lett. 19, 894 (1983).

    Article  Google Scholar 

  6. C.P. Lee, D.L. Miller, D. Hou and R.J. Anderson 41 st. D.R.C., p. II A-7 (1983).

    Google Scholar 

  7. R. Fisher, T.J. Drummond, W. Kopp, H. Morkoc, K. Lee and M.S. Shur, Electron. Lett. 19, 189 (1983).

    Article  Google Scholar 

  8. H. Dampkas, W. Brokerhoff and K. Iterme, Electron, Lett. 20, 615 (1984).

    Article  Google Scholar 

  9. A. Christou and N. Papanicolaou, SolidState Electr. 29, No 2, 189–192 (1986).

    Google Scholar 

  10. W.T. Anderson, D.V. Morgan, F.A. Buot, and A. Christou, Quality and Reliability Engineering International, Vol. 4, pp. 255–2689 (1988).

    Google Scholar 

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© 1990 Kluwer Academic Publishers

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Christou, A. (1990). Reliability of High Speed HEMT Integrated Circuits and Multi-2DEG Structures. In: Christou, A., Unger, B.A. (eds) Semiconductor Device Reliability. NATO ASI Series, vol 175. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-2482-6_32

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  • DOI: https://doi.org/10.1007/978-94-009-2482-6_32

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-7620-3

  • Online ISBN: 978-94-009-2482-6

  • eBook Packages: Springer Book Archive

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