Abstract
Photolithographic techniques, in particular those based on optical projection with visible/near-UV radiation, have attained a major role in integrated circuit manufacturing because they provide a unique combination of high precision, high volume and low cost. In these methods an opaque pattern on a trans-illuminated mask is imaged onto a photoresist—coated wafer. The intensity distribution in the image plane is imprinted on the wafer in two steps: photoinduced modification of the resist, followed by development. Conventionally, the photon sources in projection systems have been mercury lamps, operating at 436 nm, and more recently at 405 nm and 365 nm (the G, H, and I lines, respectively, in the emission spectrum of Hg atoms) [1].
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© 1988 Martinus Nijhoff Publishers
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Rothschild, M., Ehrlich, D.J. (1988). Excimer Laser Projection Patterning. In: Ehrlich, D.J., Nguyen, V.T. (eds) Emerging Technologies for In Situ Processing. NATO ASI Series, vol 139. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1409-4_10
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DOI: https://doi.org/10.1007/978-94-009-1409-4_10
Publisher Name: Springer, Dordrecht
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