Abstract
The development of microdielectrometry has made possible production monitoring and cure control in a variety of thermoset resin based systems. As the demands of the technology grow, existing sensors must be demonstrated to have applicability or new sensors must be designed.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
S.D. Senturia, N.F. Sheppard, H.L. Lee, and D.R. Day, “In Situ Measurement of the Properties of Curing Systems with Microdielectrometry,” Jrnl. Adhesion, 15, 69 (1982)
N.F. Sheppard, M. Coln, and S. Senturia, “A Dielectric Study of The Time Temperature Transformatton (TTT) Diagram of DEGBA Epoxy Resins Cured with DDS,” Proc. 29th SAMPE Symposium, Reno, NV, 1243 (1984)
A.R. Blythe, “Electrical Properties of Polymers,” Cambridge University Press, Cambridge.
D.R. Day, T.J. Lewis, H.L. Lee, and S.D. Senturia, “The Role of Boundary Layer Capacitance at Blocking Electrodes in the Interpretation of Dielectric Cure Data in Adhesives,” Jrnl. Adhesion, 18, 73 (1984)
“Computer Aided Curing of Composites,” 5th Quarterly Interim Technical Report, Contract F33615-83-C-5088, McDonnell Aircraft Company, St. Louis, MO, July 1985
M.L. Bromberg, D.R. Day, and K.R. Snable, “Measurement and Application of Dielectric Properties,” Electrical Insulation, 2,18 (1986)
D.R. Day, “Effects of Stoichiometric Mixing Ratio on Epoxy Cure: A Dielectric Analysis,” SPE Technical Papers, 31, 327 (1985)
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 1989 Springer Science+Business Media B.V.
About this chapter
Cite this chapter
Day, D., Lee, H., Russell, K., Whiteside, J. (1989). Cure Characteristic Determination Using Microelectronic Dielectric Sensors. In: Bunsell, A.R., Lamicq, P., Massiah, A. (eds) Developments in the Science and Technology of Composite Materials. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-1123-9_106
Download citation
DOI: https://doi.org/10.1007/978-94-009-1123-9_106
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-6997-7
Online ISBN: 978-94-009-1123-9
eBook Packages: Springer Book Archive