Abstract
During integrated circuit (IC) fabrication, silicon wafers are exposed to a large number of individual well-defined process steps (up to 200), which together constitute the “fabrication process”. In the fabrication process only a few key steps, generally between about 20 and 50, have a direct effect on the performance characteristic of the finished electrical device or circuit. Since the final yield (number of chips per wafer that have passed the final quality control) depends on the yield of the individual processes, it is advantageous to have diagnostic (analytical) techniques for these key steps to ensure that a crucial “fault” in one process is not carried through to succeeding steps. The increasing importance of analytical techniques applied to silicon technology is evident from the large number of publications on this subject that have appeared in recent years (Fig. 1).
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References
R. K. Lowry, Anal. Chem., 58, 23a (1986).
W. G. Gelling and F. Valster, Philips Tech. Rev., 42, 266 (1985/86).
M. Grasserbauer, G. Stingeder, H. Poetzl, and E. Guerrero, Fresenius Z. Anal. Chem., 323, 421 (1986).
T. Abe, VLSI Electronics: Microstructure Science, Vol. 12, N. G. Einspruch and H. Huff, Eds., Academic Press, New York (1985), p. 3.
VLSI Electronics: Microstructure Science, Vol. 12, N. G. Einspruch and H. Huff, Eds., Academic Press, New York (1985).
K. V. Ravi, see Chapter 14.
C. W. Pearce, VLSI Technology, S. M. Sze, Ed., McGraw-Hill, New York (1983), p. 51.
VLSI Technology, S. M. Sze, Ed., McGraw-Hill, New York (1983).
H. D. Jonker, A. E. Morgan, and H. W. Werner, J. Cryst. Growth, 31, 387 (1975).
W. C Dash, J. Appl. Phys., 29, 736 (1958).
H. Foell and B. O. Kolbesen, Appl. Phys., 8, 319 (1975).
M. L. Verheijke, H. J. J. Jaspers, J. M. G. Hanssen, and M. J. J. Theunissen, J. Radioanal. & Nucl. Chem., 113, 397 (1987).
H. W. Werner, Fresenius Z. Anal. Chem., 314, 274 (1983).
H. W. Werner, Appl. Surf. Anal., ASTM STP 699, T. L. Barr and L. E. Davis, Eds., (1980), p. 81.
W. Fichtner, see Chapter 15.
D. A. Antoniadis, VLSI Electronics: Microstructure Science, Vol. 12, N. G. Einspruch and H. Huff, Eds., Academic Press, New York (1985), p. 271.
P. R. Boudewijn, unpublished.
R. Levi-Setti, G. Crow, and Y. L. Wang, Secondary Ion Mass Spectrometry, SIMS V, Chem. Phys., 44, A. Benninghoven, R. J. Colton, D. S. Simons, and H. W. Werner, Eds., Springer-Verlag, Berlin (1985), p. 132.
B. Koeneman, J. Mucha, and G. Zwiehoff, IEEE J. Solid-State Circuits, SC-15, 315 (1980).
B. Otterloo and A. Reader, private communication 1986.
H. W. Werner, Topics in Current Phys., Vol. 37, Thin Film and Depth Profile Analysis, H. Oechsner, Ed., Springer-Verlag, Berlin (1984), p. 5.
H. W. Werner and R. P. H. Garten, Rep. Prog. Phys., 47, 221 (1984).
H. W. Werner, Proc. of the 7th Int. Vac. Congr. and the 3rd Int. Conf. on Solid Surfaces, Vienna (1977), p. 2135.
P. Sigmund, Phys. Rev., 184, 383 (1969).
The Physics of Microfabrication, I. Brodie and J. J. Muray, Eds., Plenum, New York (1984), p. 212.
H. W. Werner and P. R. Boudewijn, Vacuum, 34, 83 (1984).
A.V. Oostrom, unpublished.
R.V. Criegern, T. Hillhner, and H. Rehme, Siemens Forsch.-& Entwicklungsber., 14, 201 (1985).
F. G. Rüdenauer, Secondary Ion Mass Spectrometry, SIMS III, Chem. Phys., 19, A. Beninghoven, J. Giber, J. Laszlo, M. Riedel, and H. W. Werner, Eds., Springer-Verlag, Berlin (1981), p. 18.
VLSI Technology, S. M. Sze, Ed., McGraw-Hill, New York (1983).
H. W. Werner, Surf & Interface Anal, 2, 56 (1980).
H. W. Werner and H. A. M. de Grefte, Surf Sci., 35, 458 (1973).
J. L. Maul, Thesis, Technical University, München (1974).
E. Bruninx and L. C Bastings, Philips Tech. Rev., 34, 350 (1974).
H. W. Werner, Vacuum, 24, 493 (1974).
S. Hofmann, Surf & Interface Anal., 2, 148 (1980).
S. Hofmann, Appl. Phys., 9, 9 (1976).
J.V.D. Berg, 1985; unpublished.
C W. T. Bulle-Lieuwma, 1984; unpublished.
H. W. Werner and N. Warmoltz, J. Vac. Sci. & Technol, A2, 726 (1984).
R. B. Marcus, VLSI Technology, S. M. Sze, Ed., McGraw-Hill, New York (1983), p. 507.
A. Reader and M. Geyselaers, unpublished.
J. James, Microscopische waarnemingsmethoden, A. Oosthoek’s Uitgeversmaatschappij, Utrecht, The Netherlands (1969), p. 58.
H. W. Werner, Appl. Surf Anal., ASTM STP 699, T. L. Barr and L. E. Davis, Eds., (1980), p. 81.
T. Wilson and C Sheppard, Theory and Practice of Scanning Optical Microscopy, Academic Press, London (1984).
P. W. J. M. Boumans, Fresenius Z. Anal. Chem., 291, 10 (1978).
P. W. J. M. Boumans, Fresenius Z. Anal. Chem., 299, 337 (1979).
V. A. Fassel, Fresenius Z. Anal. Chem., 324, 511 (1986).
H. W. Werner and H. A. M. de Grefte, Vak.-Tech. 17, 37 (1968).
H. W. Werner, Vacuum, 22, 613 (1972).
R. Borchert, unpublished.
G. N. Nijman, Reichert Product News, 9/85.
R. B. Marcus, VLSI Technology, S. M. Sze, Ed., McGraw-Hill, New York (1983), p. 511.
G. J. Brakenhoff, J. S. Binnerts and C L. Woldringh, Scanned Image Microscopy, E. A. Ash, Ed., Academic Press, London (1980).
C Zeiss, Oberkochen, BRD, Product News (1985).
J. B. Theeten and D. E. Aspnes, Am. Rev. Mater. Sci., 11, 97 (1981).
D. E. Aspnes and J. B. Theeten, Acta Electron., 24, 217 (1981/1982).
H. Remmerie, Thesis, University Leuven (1986).
P. Stallhofer and D. Huber, Solid State Technol., 26, (8) 233 (1983).
B. Otterloo, to be published.
H. J. Heinen and R. Holm, Scanning Electron Microsc, 449 (1984).
C Evans, paper presented at ISM 1986, Antwerp.
W. Reuter, Secondary Ion Mass Spectrometry, SIMS V, Chem. Phys., 44, A. Benninghoven, R. J. Colton, D. S. Simons, and H. W. Werner, Eds., Springer-Verlag, Berlin (1985), p. 94.
R. Delhez and E. J. Mittemeijer, J. Appl. Crystallogr., 8, 609 (1975).
W. J. Bartels, J. Hornstra, and D. J. W. Lobeek, Acta Crystallogr., A42, 539 (1986).
W. J. Bartels, C. Langereis, and H. Smoorenburg, unpublished.
W. J. Bartels and W. Nijman, J. Crystal Growth, 44, 518 (1978).
A. Fukuhara and Y. Takono, Acta Crystallogr., A33, 137 (1977).
B. C. Larson and J. F. Bathorst, J. Appl. Phys., 5, 3181 (1980).
A. W. Witmer, unpublished.
P. Volbert, Philips Anal. Data Bull., Leaflet No. 9498 303 02811, (1985).
Surface Science Laboratories Inc. Application Notes, California, USA.
Surface Science Laboratories Inc. Application Notes, Winter 1985, California, USA.
R. Holm and S. Storp, Appl. Phys., 12, 101 (1977).
R. Holm and S. Storp, Phys. Scr., 16, 442 (1977).
D. K. Bakale, R. Lindner, and C. E. Bryson, Proc. SPIE Int. Soc. Opt. Eng., 524, 2 (1985).
P. Willich and D. Obertop, X-Ray Spectrom., 11, 32 (1982).
P. Willich, D. Obertop, and H. J. Tolle, X-Ray Spectrom., 14, 82 (1985).
J. L. Pouchou and F. Pichoir, Rech. Aerosp., 5, 349 (1984) 47 (1984–5).
L. Reimer, Scanning Electron Microscopy, Springer Series in Optical Sciences, Vol. 45, Springer-Verlag, Berlin (1985).
T. E. Everhart and P. H. Hoff, J. Appl. Phys., 42, 5837 (1971).
B. Lischke, J. Frosien, and R. Weyl, Siemens Forsch.-& Entwicklungsber., 14, 177, (1985).
R. Borchert and H. W. Werner, 1986; unpublished.
V. N. E. Robinson, Data sheet, 1986.
P. H. W. Woerlee, to be published.
D. Green, J. E. Sandor, T. W. O’Keeffe, and R. K. Matta, Appl. Phys. Lett., 6, 3 (1965).
W. J. Keery, K. O. Leedy, and K. F. Galloway, Scanning, 508 (1976).
A. Ya. Vyatskin, and A. N. Pilyankevich, Sov. Phys. Solid State, 5, 1662 (1964).
E. Menzel and E. Kubalek, Scanning, 5, 103 (1983).
H. Salow, Z. Technol. Phys., (1), 13 (1940).
H. Seiler, J. Appl. Phys., 54, R1 (1983).
J. J. L. Mulders, private communication 1986.
H. Rehmer and H. Oppolzer, Siemens Forsch.-& Entwicklungsber., 14, 193, (1985).
H. Schink and H. Rehme, Beitr. Elektronenmikroskop. Direktabb. Oberfl., 16, 287 (1983);
H. Rehme, Electron. Lett., 19, 383 (1983).
R.V. Criegern and T. Hillhner, Fresenius Z. Anal. Chem., 319, 861 (1984).
R. Hezel, Solid State Electron., 22, 735 (1979).
E-beam testing, ICT GmbH, Ottobrunn-Riemerling, FRG (1984).
T. Roebuck, private communication 1986.
P. Fazekas, H. P. Feuerbaum, and E. Wolfgang, Electronics, July 1981, p. 105.
F. J. A. Lier, unpublished 1986.
E-beam testing, ICT GmbH, Ottobrunn-Riemerling, FRG (1984).
K. Nakamae, H. Fujioka, and K. Ura, J. Appl. Phys., 52, 1306 (1981).
E. Wolfgang, Scanning, 5, 71 (1983).
H. Fujioka, K. Nakamae, and K. Ura, IEEE J. Solid State Circuits, SC-15, 177 (1980).
M. P. A. Viegers, Invited paper presented at the ECASIA meeting 1985, unpublished.
C. W. T. Bulle-Lieuwma, and P. C Zalm, Surf. & Interface Anal. 10, 210 (1987).
A. Reader, M. Geyselaers, M. P. A. Viegers, and B. Koek, unpublished.
M. P. A. Viegers, private communication 1986.
M. P. A. Viegers and B. Koek, unpublished.
M. P. A. Viegers, C. W. T. Bulle-Lieuwma, P. C. Zalm, and P. M. J. Maree, Mater. Res. Soc. Symp. Proc, 37, 331 (1985).
J. W. Edington, Monographs in Practical Electron Microscopy in Material Science, Philips Technical Library, Macmillan Press, London (1975); particularly monographs 2 and 3.
M. H. Loretto, Electron Beam Analysis of Materials, Chapman and Hall, London (1984).
R. B. Marcus and T. T. Sheng, Transmission Electron Micrscopy of Silicon VLSI Circuits and Structures, Wiley, New York (1983).
H. Ibach, H. D. Bruckman, and H. Wagner, Appl. Phys., A29, 113 (1982).
R. K. Lowry, Anal. Chem., 58, 23A (1986).
M. P. Seah and W. A. Dench, Surf & Interface Anal, 1, 2 (1979).
D. Briggs and M. P. Seah, Practical Surface Analysis by Auger and X-ray Photoelectron Spectroscopy, D. Briggs and M. P. Seah, Eds., John Wiley & Sons, New York (1984), p. 95, 186, and 193.
B. Otterloo, private communication 1986.
C Evans, private communication 1985.
R.V. Criegern, T. Hillmer, and I. Weitzel, Fresenius Z. Anal. Chem., 314, 293 (1983).
J. M. Walls, D. D. Hall, and D. E. Sykes, Surf & Interface Anal., 1, 204 (1979).
H. H. Brongersma, F. Meijer, and H. W. Werner, Philips Tech. Rev., 34, 357 (1974).
H. W. Werner, H. A. M. de Grefte, and J.V.D. Berg, Radiat. Eff., 18, 269 (1973).
H. W. Werner, A. E. Morgan, and H. A. M. de Grefte, Appl. Phys., 7, 65 (1975).
H. W. Werner, Proc. of Conf on Electron and Ion Spectroscopy of Solids, L. Fiermans, J. Vennik, and W. Dekeyser, Eds., Plenum, New York (1978), p. 324.
A. Benninghoven, F. G. Rüdenauer, and H. W. Werner, Secondary Ion Mass Spectrometry, John Wiley & Sons, New York (1986).
P. R. Boudewijn, unpublished.
P. R. Boudewijn and H. W. Werner, Secondary Ion Mass Spectrometry (SIMS V); Chem. Phys., 44, A. Benninghoven, R. J. Colton, D. S. Simons, and H. W. Werner, Eds., Springer-Verlag, Berlin (1985), p. 270.
P. R. Boudewijn, private communication.
P. R. Boudewijn, M. R. Leys, and F. Roozeboom, Surf & Interface Anal., 9, 303 (1986).
H. Liebl, J. Vac. Sci. & Technol., 12, 385 (1975).
Vacuum Generators Product News presented at EC ASIA 1985.
K. Wittmaack, J. Appl. Phys., 50, 493 (1979).
W. Reuter, M. L. Yu, and M. A. Frisch, J. Appl. Phys., 51, 850 (1980).
G. Borchardt, S. Scherrer, and S. Weber, Mikrochim. Acta, II, 421 (1981).
M. Grasserbauer and G. Stingeder, Thesis, University Wien, 1983.
H. W. Werner and A. E. Morgan, J. Appl. Phys., 47, 1232 (1976).
A. Benninghoven and W. K. Sichtermann, Anal. Chem., 50, 1180 (1978).
A. Benninghoven, K. T. F. Janssen, and H. W. Werner, in preparation.
H. Oechsner, Secondary Ion Mass Spectrometry (SIMS III); Chem. Phys., 19, A. Benninghoven, J. Giber, J. Laszlo, M. Riedel, and H. W. Werner, Eds., Springer-Verlag, Berlin (1982), p. 106.
H. W. Werner, Dev. Appl. Spectrosc., 7A, 239 (1969).
P. R. Boudewijn and K. T. F. Janssen, private communication 1986.
H. W. Werner, Mater. Sci. & Eng., 42, 1 (1980).
W. K. Hofker, H. W. Werner, D. P. Oosthoek, and H. A. M. de Grefte, Radiat. Eff., 17, 83 (1973).
P. R. Boudewijn and K. T. F. Janssen, Fresenius Z. Anal. Chem., in press.
K. T. F. Janssen and P. R. Boudewijn, private communication.
Y. Tamminga, private communication 1978.
G. J. V. Gurp, Semiconductor Silicon, H. R. Huff and E. Sirtl, Eds., (1977), p. 342.
H. W. Werner, Electron and Ion Spectroscopy of Solids, L. Fiermans, J. Vennik, and W. Dekeyser, Eds., (1978), p. 371.
F. H. P. M. Habraken, A. E. T. Kuiper, A.V. Oostrom, Y. Tamminga, and J. B. Theeten, Acta Electron., 24, 203 (1981/1982).
Y. Tamminga, M. F. C. Willemsen, F. H. P. M. Habraken, and A. E. T. Kuiper, Nucl Instrum. & Methods, 200, 499 (1982).
F. V. D. Weg and Y. Tamminga, Acta Electron., 19, 47 (1976).
F. H. P. M. Habraken, A. E. T. Kuiper, A.V. Oostrom, Y. Tamminga, and J. B. Theeten, Acta Electron., 24, 203 (1981/1982).
Y. Tamminga, M. F. C. Willemsen, F. H. P. M. Habraken, and A. E. T. Kuiper, Nucl. Instrum. & Methods, 200, 499 (1982).
Y. Tamminga, M. F. C. Willemsen, and R. V. Silfhout, Nucl. Instrum. & Methods Phys. Res., 218, 107 (1983).
F. H. P. M. Habraken, R. H. G. Tijhaar, F. V. D. Weg, A. E. T. Kuiper, and M. F. C. Willemsen, J. Appl. Phys., 59, 447 (1986).
E. J. Evers and F. H. P. M. Habraken, Spectrochim. Acta, 39B, 1553 (1984).
W. J. M. J. Josquin and Y. Tamminga, J. Electrochem. Soc., 129, 1803 (1982).
M. J. M. Pruppers, F. Zijderhand, K. M. H. Maessen, J. Bezemer, F. H. P. M. Habraken, and F. V. D. Weg, Nucl. Instrum. & Methods Phys. Res., B15, 512 (1986).
M. J. J. Theunissen, H. J. J. Jaspers, J. M. G. Hanssen, and M. L. Verheijke, Modern Trends in Activation Analysis.
G. Binnig and H. Rohrer, Surf. Sci., 126, 236 (1983).
M. V. D. Walle, Thesis, University Nijmegen, 1985.
P. Murait and D. W. Pohl, Appl. Phys. Lett., 48, 514 (1986).
H. V. Kempen, private communication 1986.
O. Breitenstein and I. Heydenreich, Scanning, 7, 273 (1985).
C. F. Quate, Sci. Amer., 241, 62 (1969).
R. Koch, Prakt. Metallogr., 16, 11 (1979).
Letter to the editor, Prakt. Metallogr. 14, 282 (1979).
I. Brodie and J. L. Muray, The Physics of Microfabrication, Plenum, New York (1984), p. 413.
Leitz Product News, 1985.
J.V.D. Berg, unpublished 1986.
A.V. Oostrom, Vacuum, 34, 881 (1984).
P. Steffens, E. Niehuis, T. Friese, D. Greifendorf, and A. Benninghoven, Secondary Ion Mass Spectrometry SIMS IV; Chem. Phys., 36, A. Benninghoven, J. Okano, R. Shimizu, and H. W. Werner, Eds., Springer-Verlag, Berlin (1984), p. 404.
W. Heywang, Siemens Forsch.-& Entwicklungsber., 14, 147 (1985).
An Introduction to Microscopy by Means of Light, Electrons, X-rays, or Ultrasound, T. G. Rochow and E. G. Rochow, Eds., Plenum, New York (1978).
C W. T. Bulle-Lieuwma and M. P. A. Viegers, private communication 1986.
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Werner, H.W. (1989). Diagnostic Techniques. In: Levy, R.A. (eds) Microelectronic Materials and Processes. NATO ASI Series, vol 164. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0917-5_16
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