Etching

  • George E. Anner

Abstract

Chapter 1 showed the need for selective etching, whereby an etchant attacks one material, such as SiO2, while leaving relatively unaffected adjacent materials, such as Si and Al. Etching processes are discussed in greater detail in this chapter

Keywords

Etch Rate Wafer Surface Plasma Etching Anisotropic Etching Parallel Plate Electrode 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Van Nostrand Reinhold 1990

Authors and Affiliations

  • George E. Anner
    • 1
  1. 1.University of IllinoisChampaign-UrbanaUSA

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