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Microelectronics Packaging/Interconnect: An Industry in Transition

  • Daniel C. Blazej

Abstract

This presentation is adapted from a report prepared for the National Security Industrial Association (NSIA) by a Task Force formed to assess the potential impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applications could extend beyond the traditional military electronics industry. Some of the comments in this presentation are the author’s opinion only and may not represent the consensus position of either the Task Force or Allied-Signal.

Keywords

Consumer Electronic Multilayer Thin Film Packaging Industry Printed Wiring Board Military System 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    “The VHSIC Program: Its Impact on the Commercial IC Industry”, The Information Network (1988).Google Scholar
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    “The World of Silicon: It’s Dog Eat Dog”, IEEE Spectrum, Sept 1988.Google Scholar
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    Ford Motor Company estimates and the University of Michigan Delphi III market research study.Google Scholar
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    Ralph Anavy “Strategy 2000”, Electronic Outlook Corporation, 1990.Google Scholar
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    “Swords Into Plowshares”, Forbes, July 23 1990.Google Scholar

Copyright information

© Van Nostrand Reinhold 1991

Authors and Affiliations

  • Daniel C. Blazej

There are no affiliations available

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