Microelectronics Packaging/Interconnect: An Industry in Transition

  • Daniel C. Blazej


This presentation is adapted from a report prepared for the National Security Industrial Association (NSIA) by a Task Force formed to assess the potential impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applications could extend beyond the traditional military electronics industry. Some of the comments in this presentation are the author’s opinion only and may not represent the consensus position of either the Task Force or Allied-Signal.


Consumer Electronic Multilayer Thin Film Packaging Industry Printed Wiring Board Military System 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Van Nostrand Reinhold 1991

Authors and Affiliations

  • Daniel C. Blazej

There are no affiliations available

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