Parameterization of Fine Pitch Processing
Assembly of large fine pitch gull wing leaded surface mount components has become a necessity in the printed circuit board assembly industry. The assembly process yields are limited by practical barriers originating in component and bare board construction constraints and material variations as well as the assembly process itself. It is the purpose of this paper to identify and quantify these areas and present assembly yield data obtained in a carefully controlled manufacturing environment. The variations observed in the materials is then summarized and a Monte Carlo technique used to simulate a pick-and-place process yield model.
KeywordsPrint Circuit Board Fine Pitch Component Placement Placement Yield Placement Site
Unable to display preview. Download preview PDF.
- 1.Hadco Corporation, Solderability Issues of SMT PWB’s. April 1990.Google Scholar